Industry Directory | Manufacturer's Representative
Manufacturers Representatives for SMT Equipment and Materials serving Southern California and Baja, MX
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New Equipment | Solder Materials
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Electronics Forum | Fri Feb 09 12:31:35 EST 2007 | realchunks
Ask Brain Toleno at "circuitsassembly.com/blog" He's a smart guy and works as team lead at Henkel Loctite. Just don't take him out for drinks.
Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef
Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Parts & Supplies | Assembly Accessories
FUJI Nozzle in stock FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 0.7 / 1.0 / 1.3 / 1
Parts & Supplies | Assembly Accessories
FUJI Nozzle in stock FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 0.7 / 1.0 / 1.3 / 1
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
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