Industry Directory | Distributor
Practical Tools offers brand name products including Scienscope Microscopes and Inspection Equipment, Excelta, Weller, Hakko, 3M, Henkel (Multicore/Loctite/Hysol), Tech Spray, Micro Care, Lindstrom, X
Industry Directory | Distributor
Practical Tools is an authorized distributor of tools and supplies for all types of industries including Bio-Medical Manufacturing & Research, Electronics Assembly, Military and Aerospace Manufacturin
Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive diel
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Tue Feb 21 19:14:16 EST 2012 | hegemon
Have had good results with Loctite 3536 and Hysol 4527. The 3536 is easier to use and handle, and can be reworked if needed. I have no relation to, nor receive any benefit from any above mentioned company. `hege
Electronics Forum | Fri Oct 02 06:39:36 EDT 2020 | SMTA-64386317
I am using Bonotek 3400UF and Hysol for underfill application. What is your challenge on underfill process.
Used SMT Equipment | Coating and Encapsulation
PVA 2000 W1C Conformal Coating unit (2000) Brand: PVA Model: PVA2000 W1C Year: 2000 Serial #: W1233 Type: Conformal coating unit Program Revision: 3.02 PathMaster® Version: 2.00 Interrupting Capacity: 200 kA Material Coated: Loctite
Industry News | 2010-04-16 01:50:52.0
Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
