Industry Directory | Manufacturer
offers PCB manufacture service, including: Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, Aluminum PCB etc. PCB ASSEMBLY
Industry Directory | Manufacturer
Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer
9500-8608 Quantum III Drive, 100hp 230Vac, 200hp 460Vac, 338 A Cont. Output Current, Regen 9500-8608WE Extends standard warranty to 5 Years on Quantum 9500-8608 Model 9500-8609 Quantum III Drive, 125hp 230Vac, 250hp 460Vac, 428 A Cont. Output C
Ground EMI filter model GLE30-1 blocks high- frequency noise (EMI) on ground while providing while maintaining very low impedance for electrical safety. The filter is very easy to connect and it requires no maintenance. One of the most common appli
Electronics Forum | Tue Feb 19 08:49:34 EST 2008 | rgduval
Get the ionic specs from your flux manufacturer, and show it to the designer. No-clean flux/solder is supposed to be low to minimal in ionic contamination, which allow the whole no-clean thing. If he needs further proof, you can have the board io
Electronics Forum | Tue Feb 19 09:26:54 EST 2008 | jdengler
The low solids flux that is commonly called no-clean can affect some circuits. We are building a PCB that measures pico amps. The customer required that it be cleaned. We would rather used the low solids and eliminate a step. The customer had
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight E4991A Base Frequency: 100 KHz Max Frequency: 3 GHz Agilent/HP E4991A RF Impedance/Material Analyzer The E4991A RF impedance/material analyzer offers ultimate impedance measurement performance and powerful built in analysis fun
Used SMT Equipment | In-Circuit Testers
Agilent E5061B Agilent/HP E5061B Network Analyzer, 5 Hz to 3 GHz E5061B is a network analyzer, covering the broad frequency range of 5 Hz to 3 GHz , in one instrument. Applications range from general RF measurements such as filter and amplifier
Industry News | 2003-03-20 08:12:57.0
Nichicon has increased the top capacitance value of its WG series of surface mount electrolytic capacitors from 1000 to 1500uF.
Industry News | 2003-04-01 08:13:08.0
The Introbotics equipment boosts controlled impedance testing productivity and accuracy by a factor of ten compared to the handheld probing techniques.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg170, Lead-free, Low Z-axis CTE, Low water absorption. 2). Excellent thermal stability and anti-CAF performance 3). 2-30 layer, 1.6mm thick 4). 1 oz copper finished 5). 10% impedance control 6). Immersion gold, HASL LF. 7). Suitable for hig
Technical Library | 2008-02-26 15:02:19.0
More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Option 032 version: 20 Hz to 300 kHz 0.05% basic accuracy with superior measurement repeatability at low and high impedance 16 impedance parameters 4-digit resolution in any range High-resolution 7-digit LCD display 100 µ Vrms, 1 µA
Introduction of new model ST-5 of Smart Tweezers LCR-meter from Siborg Systems Inc, Waterloo, Ontario, Canada, http:\\www.smarttweezers.ca
| http://etasmt.com/cc?ID=te_news_bulletin,23363&url=_print
. Vacuum Soldering Reduction of voids in the solder joint results in: Increased thermal conductivity Low component temperature Increased durability of components
ORION Industries | http://orionindustries.com/pdfs/SILPAD900S.pdf
Gap Pad? 1500 Sil-Pad® 900S High Performance Insulator for Low Pressure Applications The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia North American Headquarterss Bramenberg 9a 9F-1, No
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