Industry Directory | Manufacturer's Representative
Manufacturers Representatives for SMT Equipment and Materials serving Southern California and Baja, MX
Industry Directory | Equipment Dealer / Broker / Auctions
TrioTek™ inline, conveyor curing ovens from ETS are ideal for medium to high-volume curing/drying of coatings, adhesives and potting compounds.
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
High-speed, High-accuracy and Stable Dispensing for High-density Mounting The YSD comes to market as the successor to Yamaha’s “YGD” dispenser model that won a reputation for answering market needs for compactness and low cost while achieving the i
Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef
Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes
Electronics Forum | Tue Aug 11 18:15:11 EDT 2009 | ysutariya
Have you looked into Sipad? They will pre-paste your BGA and other component areas with solderpaste that has an adhesive on it. You can then hand place your components and run through a reflow. Here's their site: http://www.sipad.com/
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | Senai, Johor Malaysia | Engineering,Production,Quality Control
A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.
Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers by: Prawin, Paulraj , Paul, Brian K.; OSU School
SMTnet Express, April 18, 2018, Subscribers: 31,006, Companies: 10,922, Users: 24,628 Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates Fei Peng, Naomi Ando, Roger Bernards, Bill Decesare; Mac
| http://etasmt.com/cc?ID=te_news_bulletin,9561&url=_print
; in rare cases parts on the bottom or "second" side of the board may be secured with a dot of adhesive to keep components from dropping off inside reflow ovens if the part has a large size or
Heller Industries Inc. | https://hellerindustries.com/browse/page/388/
Curing Applications Low Void Curing SW and Automation Videos & Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects
