We are a manufacturer of low maintenance small vacuum pump from Germany for semiconductor industry use in vacuum chuck, vacuum tweezer, vacuum packing, chip mounter, wafer handling, pick and place.
ComTec LLC in Manchester, New Hampshire is a manufacturer of low-cost pressure sensors, instruments, and controls. Various products include Model P500DT from 0-1"wc to 0-15"wc, P200G from vacuum to 6000psig, and P100B from vacuum
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Fri May 14 05:50:26 EDT 2021 | williamrobbins
I've only used vacuum reflow on LED boards but I have heard that Vacuum may need to be reduced depending on components. I can't find the source at the moment but it was a study done by Heller I believe. I would experiment with different levels of v
Electronics Forum | Fri Apr 13 17:11:12 EDT 2007 | jmelson
Even though this is a "no clean" flux, are you (or the customer) cleaning the boards? If this is truly a low signal level device, there is no way you will get away without cleaning the flux residue. I do a lot of low-level hardware, and we have to
Used SMT Equipment | Flexible Mounters
Product Name: Samsung SM481 high speed chip mounter Product number: SM481 Detailed product introduction Samsung SM481 high speed chip mounter parameters SM481 is based on the platform of high-speed SMT SM471 the fastest equipment at strengthening
Used SMT Equipment | SMT Equipment
Product Name: Samsung SM481 high speed chip mounter Product number: SM481 Detailed product introduction Samsung SM481 high speed chip mounter parameters SM481 is based on the platform of high-speed SMT SM471 the fastest equipment at strengthening
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | SMT Equipment
CP40 vacuum valve if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP:
Parts & Supplies | SMT Equipment
FUJI VACUUM PIN Name: FUJI VACUUM PIN Part No.: NDPH8171 Kindly contact me if you are interested. More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-1317047
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-08-19 09:46:13.0
Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice for building reliable high technology electronic products with a high degree of testability. Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service.
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Career Center | Los Angeles, Dallas, Atlanta, Texas, Georgia USA | Sales/Marketing
Client company seeks sales managers (3 Locations)who will develop a sustainable and profitable level of revenue growth for an exciting organization who has the ability to completely control the supply chain for its clients in the electronic OEM marke
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Process Technician in our Lighting Manufacturing facility in Racine, Wisconsin. Summary: This person will be a primary contributor to the startup of a new SMT production line for LED PCB Assembly. This
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Career Center | Buford, Georgia USA | Technical Support
Over 9 years of Assembleon Electronic Manufacturing Equipment training and support. Primary machine experience: FCM I, II, and Multi-Flex, ACM Micro and AX. Dedicated CTT+ Certified Training Professional. Experienced in Instructor-led training an
Article Return to Front Page A Low Temperature Alte
Article Return to Front Page A Low Temperature Alte
GPD Global | https://www.gpd-global.com/pdf/doc/Level-Detect-User-Guide-22200600.pdf
: “Low Reservoir Sensor” is tied to IO/HeadX/LevelDetect in the IO System. Verify that IO/HeadX/LevelDetect is set to the proper input for the level detect option
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/wafer-level-packaging-symposium-2022
Wafer-Level Packaging Symposium 2022 MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
