Industry Directory: low volume bga assembly (219)

Golden State Assembly

Golden State Assembly

Industry Directory | Manufacturer

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

FKN Systek

FKN Systek

Industry Directory | Manufacturer

Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.

New SMT Equipment: low volume bga assembly (227)

Precision Auger Pump

Precision Auger Pump

New Equipment | Dispensing

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

Electronics Forum: low volume bga assembly (395)

low volume /semi-automatic solutions

Electronics Forum | Wed Jun 18 16:03:03 EDT 2003 | mkehoe

Orrrrr, just buy a small reflow oven, 5K to 7K, and eliminate the paste printing by using solid solder deposition. No shorts, no opens, no cleaning, and no voids. www.sipad.com If you decide to print your own paste later you can invest the extra 30

Seeking very low volume production reflow oven

Electronics Forum | Fri Apr 21 09:07:50 EDT 2006 | Timothy

My company is currently using point source soldering of SMT components. We have seen some problems due to improper soldering and are looking to switch to a reflow oven/hotplate assembly. Our PCB's range in size but are no larger than 5"x5" and we as

Used SMT Equipment: low volume bga assembly (23)

Yamaha YV100  economical chip mounter

Yamaha YV100 economical chip mounter

Used SMT Equipment | SMT Equipment

Product name: YV100 yamaha economical chip mounter  Product number: YV100 Products in detail YAMAHA multi-function chip mounter YAMAHA YV100A Substrate size: ATS20 (end to put) W - AT assembly: L460 * W250 (Max)/L50 * W50 (Min) Substrate thick

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X multi-functional chip mounter

Yamaha YV100X multi-functional chip mounter

Used SMT Equipment | SMT Equipment

Product name: YV100X yamaha multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machine YAMAHA YV100X  substrate size: ATS20 (end to put) W - AT assembly: L460 * W250 (Max)/L50 * W50 (Min) su

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: low volume bga assembly (939)

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

GPD Global's PCD Dispensing on Its MAX Series Platform Wins Another Industry Award

Industry News | 2012-03-05 14:26:45.0

GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.

GPD Global

Parts & Supplies: low volume bga assembly (21)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Juki What is SMT? What does SMT mean? What does SMT do?

Juki What is SMT? What does SMT mean? What does SMT do?

Parts & Supplies | Pick and Place/Feeders

The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a

ZK Electronic Technology Co., Limited

Technical Library: low volume bga assembly (14)

Revolutionize PCB Manufacturing with SMT Dispensing Machines

Technical Library | 2023-12-18 11:33:57.0

Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. ​In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues

I.C.T ( Dongguan ICT Technology Co., Ltd. )

The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies

Technical Library | 2015-01-08 17:26:59.0

Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern

Sanmina-SCI

Videos: low volume bga assembly (249)

Precision Auger Pump Cleaning - Easy

Precision Auger Pump Cleaning - Easy

Videos

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Training Courses: low volume bga assembly (1)

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: low volume bga assembly (7)

India Chapter Webinar: PCBA Process Qualifications

Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,

India Chapter Webinar: PCBA Process Qualifications

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: low volume bga assembly (26)

Sales Manager

Career Center | Garland, Texas USA | Sales/Marketing

Electronics Manufacturing Company is looking for FT/PT full commission sales personnel, 25% and up commission base on value of orders ( not the bottom line). Experience on handling own sales accounts. Extra income for referrals, if you have business

1ST ARTICLE

Sale Representative

Career Center | , California Malaysia | Sales/Marketing

This is a position where the candidate is required to have knowledge in custom wire-harness, cable assembly, printed circuit board assembly (both PTH & SMT) and electro-mechanical sub-assembly. The job is independant manufacturer representative and b

Zoomic Electronics (M) Sdn Bhd

Career Center - Resumes: low volume bga assembly (13)

SMT Manager having 10 yrs in Electronic Manufacturing.

Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support

9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Express Newsletter: low volume bga assembly (1139)

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering

Partner Websites: low volume bga assembly (2521)

Used Reflow Oven For High Volume PCB Assembly - Heller

Heller Industries Inc. | https://hellerindustries.com/reflow-oven-1912exl/

Used Reflow Oven For High Volume PCB Assembly - Heller Home » Used Reflow Oven For High Volume PCB Assembly Used 1912EXL Reflow Oven Reflow Oven Model:  1912EXL DOM

Heller Industries Inc.

Small Volume Dispensing 01005

GPD Global | https://www.gpd-global.com/small-volume-dispensing.php

: 01005 GPD Global Pushes the Limits for Small Volume Dispensing, 01005 GRAND JUNCTION, CO ― October 2013 ― GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R

GPD Global


low volume bga assembly searches for Companies, Equipment, Machines, Suppliers & Information

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Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155