Industry Directory | Manufacturer
We are a manufacturer of Reed Switches, SMD Reed Sensors and other customized Magnetic sensing solutions, incorporated in 1971.
Industry Directory | Manufacturer
We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each
PCB cutting machine/PCB depaneling machine/PCB separator ASC-700 model from ASCEN technology co.,ltd The more detail and video please check the link: www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com This mac
The more detail and video please check the link: www.pcb-separator.com This machine specializing the LED aluminum board. and very popular in Europe .It can cut the board with the led chip no damage and no bend. Our SMT automation equipment
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Tue Aug 25 16:28:11 EDT 1998 | Al Knudson
Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal expan
Used SMT Equipment | Circuit Board Assembly Products
All-purpose V-CUT PCB Separator SM-4000 Straight Knife PCB depaneling machine, PCB singulation - Pneumatically driven and electric control The machine is pneumatically driven and electric control. The straight knife type depaneling machines were
Used SMT Equipment | Soldering - Reflow
Intelligent hot air lead-free reflow Oven with six heating-zones TN360C Instruction: 1: Heating system: TN360C adopts high effective nickel-chromium heating tube with advanced technology and Long life service. The hot-air circle system wh
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Pick and Place/Feeders
YMH CL-Type Part Name：HAND LEVER ASSY PART No：KW1-M114A-00X Part Name：SPROCKET AXIS ASSY PART No：K87-M112L-10X Part Name：INDENTATION LVR ASSY PART No：KW1-M1192-00X Part Name：LEVER AXIS PART No：KW1-M116K-00X Part Name：RACKING LEVER ASSY
Parts & Supplies | Pick and Place/Feeders
YAMAHA FEEDER PARTS Part Name：HAND LEVER ASSY PART No：KW1-M114A-00X Part Name：SPROCKET AXIS ASSY PART No：K87-M112L-10X Part Name：INDENTATION LVR ASSY PART No：KW1-M1192-00X Part Name：LEVER AXIS PART No：KW1-M116K-00X Part Name：RACKING LEVER
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
ASCEN specializing the PCB cutting machine, Please check: www.pcbasc.com www.aliexpress.com/store/1377040 led strip aluminum plate cutter free porn girl online v-cut pcb cutting doule layer pcb cutter depanelizing pcba plate machine aluminum pcb se
ASCEN specializing the PCB cutting machine, Please check: www.pcbasc.com www.aliexpress.com/store/1377040 led strip aluminum plate cutter free porn girl online v-cut pcb cutting doule layer pcb cutter depanelizing pcba plate machine aluminum pcb se
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | San Diego, California USA
San Diego Chapter In-Person Event: Reclaiming Precious Metal from SMT Scrap
KingFei SMT Tech | https://www.smtspare-parts.com/sale-36275313-klw-m914w-000-plate-spring-for-yamaha-nozzle-shaft.html
KLW-M914W-000 Plate Spring For Yamaha Nozzle Shaft Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/pelletizers/wrp-12i-in-line-pelletizer
: Uniform polymer flow to die plate Lower inlet pressure = increased rates Rapid blade and die plate removal Fast color changes Easy clean-out Simple start-up and operation Improved pellet dryness Easy dryer access and cleanability Insensitive to process variations Features
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