Industry Directory | Manufacturer
A specialty chemical and material manufacturer catering to the bare board PCB industry. The company offers a wide range of chemical products that range from Photoresist strippers to Electroless Copper to a variety of final finish products.
1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho
1��Materials��FR-4��CEM-1�� High-Tg170, Teflon, Aluminum-base, Iron-base 2��Layers: Single, Double Side, Multi Layers (Less than 22 Layers) 3��Finished Surface: HAL,Lead Free HAL, Immserion Gold,Plating Flash Gold, O.S.P., Gold-Finger, Carbon Ink, P
Electronics Forum | Tue Apr 08 22:41:22 EDT 2008 | davef
Duno. Which LPI Solder Mask are you using?
Electronics Forum | Tue Apr 08 15:27:33 EDT 2008 | arminski
hi experts, need more info on what's happening with the LPI Solder Mask on an FR4 PCB during reflow of both Leaded and Lead Free Process? Do they become soft as well while exposed to the extreme temperatures? regards,
Industry News | 2018-10-18 10:24:59.0
Printed Circuit Board Solder resist
Industry News | 2008-10-29 16:47:50.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that Genesis Materials Technology (GMT) has recently dramatically improved the ENIG resistance of Florida CirTech's water-based AQ2000 LPI solder mask. AQ2000 LPI is now able to withstand the harsh chemical conditions found in the ENIG process.
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Parts & Supplies | Pick and Place/Feeders
PANASONIC NMP BALL SPLINE N510056485AA LT4X-141.4LP-(I) www.greensmt.com
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Parts & Supplies | Chipshooters / Chip Mounters
There is stock for sale. If you are interested, please contact us for a quotation by email. Email: info@qosmt.com
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-guidance-request-from-tim-c_topic538.xml
;If you do not mention the plug fill material in your fabrication notes, LPI solder mask is the default. But if you have high current you should probably request Dupont Silver Epoxy
| http://www.thebranfordgroup.com/dnn3/Employees/OnlineAuctionAdmin/TRCCircuits/tabid/1902/Default.aspx
: Chemcut 2321RD Water Rinser-Panel Dryer, s/n 248-500, (2007 yr.) Category: 17 Chemcut CC410-20 LPI (Soldermask) Developer, 20" Capacity, s/n 065-5008 Sold at TRC Circuits on 11/30/2022 Vadnais Heights MN Previous Item Next Item Lot Number: 17 Description
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