New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a highquality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board a
New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Electronics Forum | Thu Sep 17 12:00:19 EDT 1998 | Mike C
| | I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? | Wayne: More of the same as Chry and Justin. | KEY ISSUE | The first thing that you need to know is: What does your cus
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Technical Library | 2019-04-04 15:39:49.0
Siemens announced today the introduction of Camstar™ Electronics Suite software, an innovative manufacturing execution system (MES) for electronics. Building on the successful enterprise-level platform for integrated circuit (IC) manufacturing, this powerful, configurable and scalable MES solution enables printed circuit board (PCB) and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct Internet of Things (IoT) connectivity with machines and production lines.
Technical Library | 2009-01-21 23:16:14.0
This paper describes a new approach to drying circuit board assemblies that significantly reduces the cost of ownership of an aqueous cleaning system. Drying performance is increased through a hybrid drying process that reduces energy input, exhaust requirements and sound levels. The combination of high temperature blow-off and convection brings the flexibility to tailor drying performance to fit the product's drying requirements.
Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
New system solution for applications such as adhesive bonding, potting and sealing https://www.scheugenpflug-dispensing.com/en/products/system-solution.html Web: https://www.scheugenpflug-dispensing.com Facebook: https://www.facebook.com/scheugenp
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Sat Jul 06 00:00:00 EDT 2019 - Sat Jul 06 00:00:00 EDT 2019 | Chennai, India
Reliable Electronics for the Automotive Industry Technical Workshop
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
SMTnet Express June 20, 2013, Subscribers: 26136, Members: Companies: 13402, Users: 34820 Implementation of Effective ESD Robust Designs by: Industry Council on ESD Target Levels While IC level ESD design and the necessary protection levels
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Yue Deng1,*, Xike Zhao2
| https://www.smtfactory.com/What-Tests-are-Required-for-a-Qualified-Reflow-Oven-Before-it-Shipped-to-The-Customer-id3385161.html
What Tests are Required for a Qualified Reflow Oven Before it Shipped to The Customer? - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
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