Industry Directory | Consultant / Service Provider / Manufacturer
SMT, AI & Product Sourcing
Yamaha nozzle 71A M/P: +86 15323874439 becky(at)hysmt(dot)cn beckysusmt(at)hotmail(dot)com Skype: beckysmt www(dot)smt-cn(dot)com
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Samsung SM Series feeders We have lot of Samsung SM Serise feeders in stock for sale. 8x2/4, 12/16/24/32/44/56mm available. Any interested please contact me for more details. Thanks! We are professional SMT part supplier,if you are interested in
Electronics Forum | Mon Jan 11 09:00:17 EST 1999 | Kelvin Chow
Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? Kelvin
Electronics Forum | Tue Jan 12 19:57:37 EST 1999 | Ross Berntson
| Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | Kelvin
Used SMT Equipment | Pick and Place/Feeders
Yeah it's old, but it is a working placement machine, spare parts available, and it's cheap. Specifications: 4 spindle head ULC's: 4m/p circular & 4m/p circular Facilities: 230V, 3phase Dimms: 66"x86" at 6,000 lbs DOM: 1993
Industry News | 2016-10-13 16:00:08.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2011-06-01 23:41:24.0
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Jack Reinke, Southeastern Regional Sales Manager, will moderate the panel discussion titled “What’s New in Electronic Assembly Cleaning” at the upcoming Space Coast Expo and Tech Forum.
Parts & Supplies | Screen Printers
DEK Wiping mechanism magnet spring-G0332 (FLEXO) MORE DEK PARTS IN STOCKS DEK STEPPER MOTOR 140452-181245 DEK SPRING SHAFT KIT 145884 DEK SPRING G0332 DEK SOLVENT PUMP ASSY 191088 DEK SOLVENT 183668 DEK SOLENOID VALVE 165431 DEK SINGLE BOARD
Parts & Supplies | Screen Printers
DEK plywood cylinder (158921) Description: DEK plywood cylinder CYLINDER ^ PNEUMATIC ^ COMPACT ^ 12X10 Part NO.: 158921 MORE DEK PARTS IN STOCKS DEK STEPPER MOTOR 140452-181245 DEK SPRING SHAFT KIT 145884 DEK SPRING G0332 DEK SOLVENT PUMP
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Make: Universal Instruments Model: Genesis GX-11 Vintage: 2014 Details: Software Version 6.08 Head Assembly: Inline 4 Genesis 1M/P PEC Camera Removable Feeder Bank Assembly Magellen 2.3MPP Camera NPI Mode Left to Right Board Transport 3MM Cleara
Sales manager: Mac Xie Mobile: +8618020714662(WhatApp) Email: at@mooreplc.com Skype: +8618020714662 Product Detail Brand:Other Item NO.:443M-P S403AM-PB Order(MOQ):1 Payment:T/T Color:Brand New Shipping Port:Xiamen Lead Time：In Stock Q&
Career Center | GURGAON, India | Engineering,Quality Control,Research and Development
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Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
