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Electronics - Assembly and Packaging

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=10

- Application Note 540 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 TSOP DIE CRACKS Nordson SONOSCAN TSOP Die Cracks - Application Note 309 DELAMINATIONS

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SMT feeders

High Precision Fluid Dispensers
Selective Soldering Nozzles

High Throughput Reflow Oven
Software for SMT

World's Best Reflow Oven Customizable for Unique Applications
Assembly Automation Technology

Original SMT Feeders and spares for Panasonic, Fuji , Yamaha, Juki , Samsung