Industry Directory | Manufacturer
Modular pick and place automation - tape and reel - tube feeder - coplanarity check - assembly machine - contactless pick and place
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Electronics Forum | Fri Nov 19 22:00:44 EST 1999 | park kyung sam
Hello. smtguys Is there any body who has or know the in -line machine inspecting the solder paste after printing . what i only know is the centry 2000 made by the CYBER OPTICS. anything else ? for inspecting total pad on b'd. and i want to know th
Electronics Forum | Wed Sep 16 04:43:28 EDT 1998 | Michael Fogel
Does anybody knows of a used placement machine that can handle boards (Back-plans) of 650mmL x 550mmW with placement area of 500mm x 540mm ?
Used SMT Equipment | Chipshooters / Chip Mounters
1999 Fuji IP-III SMT Pick & Place Note: This lot contains two items. (1) Fuji IP-III SMT Pick & Place Approx Dimensions: 126" x 78" x 78" (1) Fuji MTU-4R Tray Tower Approx Dimensions: 43" x 87" x 70" Location: Jasper, IN USA Serial: 1514 Features: o
Used SMT Equipment | General Purpose Equipment
the machine is for C type 402 never used!! please contact for more information
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
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Parts & Supplies | SMT Equipment
Cylinder for YAMAHA machine YV180XG CYLINDER KOGANEI CRB-137W YV88 CYLINDER YMDAGS 10*40-33W YV180 CYLINDER KGD-M9279-01X PBSA10X10 YV100II PUSH IN CYLINDER KV7-M9229-00X PBDA10*30 YV100II PUSH UP CYLINDER KU0-M9217-
Parts & Supplies | SMT Equipment
Cylinder for YAMAHA machine YV180XG CYLINDER KOGANEI CRB-137W YV88 CYLINDER YMDAGS 10*40-33W YV180 CYLINDER KGD-M9279-01X PBSA10X10 YV100II PUSH IN CYLINDER KV7-M9229-00X PBDA10*30 YV100II PUSH UP CYLINDER KU0-M9217-
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-21 09:46:03.0
SMT machines have become indispensable production equipment in the automotive electronics industry.They can more effectively produce high-quality and complex electronic components and quickly respond to market demand...... KINGSUN professional provides various brands new and refurbished SMT equipment , as well as global one-stop solution services.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | new york, Kentucky USA | Purchasing
We want somebody in smt industry outside china to work with us!the candinate should offer information of the used pick and place machines,and check,confirm and ship the equipments to HongKong, Please contact us if you are interested! David
Career Center | San Diego, California USA | Engineering,Management,Production
Customer interaction, inventory and delivery of Stencils. In charge of the Satellite Operation in San Diego, Ca. Report to Headquarters in Lake Forest, Ca. Duties and responsibilities: Take full responsibility for the Satellite Operation facility.
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
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