Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
New Equipment | Board Handling - Conveyors
Model No: KSUN 460A Destacker / Push-up Stacker MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 8 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 150 VA Air pressure: 4-6 bar Air volume: MAX
New Equipment | Board Handling - Conveyors
Model No: KSUN 350A Destacker / Push-up Stacker MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 8 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 150 VA Air pressure: 4-6 bar Air volume: MAX
Electronics Forum | Tue Mar 22 22:42:18 EDT 2016 | ttheis
Apparently the machine is now completing initialization but when attempting to zero axis' it has a time-out waiting to change modes. Machine status page shows an error reading "initialization failure for motion control board."
Electronics Forum | Wed Mar 20 18:11:10 EDT 2013 | garym4569
Is the problem with the same component or manufacturer? Just for kicks, load a different component on the same feeder. Run machine in trial mode and place only that component on double sided tape. Gary
Used SMT Equipment | Pick and Place/Feeders
Product number: RX - 6 Detailed product introduction Characteristic： With high productivity, versatility, highquality new modular placement machine RX - 6 listed Draw/monitor corresponding patch Components in speed Chip components: 42000 CPH *
Used SMT Equipment | SMT Equipment
Product name: RX - 6 high-speed module chip mounter Product number: RX - 6 Detailed product introduction Characteristic： With high productivity, versatility, high quality new modular placement machine RX - 6 listed Draw/monitor corresponding p
Industry News | 2014-01-07 18:55:28.0
Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Parts & Supplies | Circuit Board Assembly Products
Feeder storage cart for YAMAHA machine Supply Smt feeder storage cart for YAMAHA YS & YV&YG machine Specifications 1.Feeder cart 2.for yamaha feeders 3.Two layers,40pcs per layer 4.800x600x1100mm 5.With four metal castor Feeder
Parts & Supplies | Storage Equipment
Feeder storage cart for YAMAHA machine Supply Smt feeder storage cart for YAMAHA YS & YV&YG machine Specifications 1.Feeder cart 2.for yamaha feeders 3.Two layers,40pcs per layer 4.800x600x1100mm 5.With four metal castor Feede
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Technical Library | 2015-07-01 16:51:43.0
Aerospace and military companies continue to exercise RoHS exemptions and to intensively research the long term attachment reliability of RoHS compliant solders. Their products require higher vibration, drop/shock performance, and combined-environment reliability than the conventional SAC305 alloy provides. The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. One possible route to improvement of the mechanical and thermo-mechanical properties of solder joints is the use of Pb-free solders with lower process temperatures. Lower temperatures help reduce the possibility of damaging the boards and components, and also may allow for the use of lower Tg board materials which are less prone to pad cratering defects. There are several Sn-Ag-Bi and Sn-Ag-Cu-Bi alloys which melt about 10°C lower than SAC305. The bismuth in these solder compositions not only reduces the melting temperature, but also improves thermo-mechanical behavior. An additional benefit of using Bi-containing solder alloys is the possibility to reduce the propensity to whisker growth
SMT Machine Automatic PCB Destacker PCB Bare Board Loader Product introduction: 1.This unit is used to send bare PCBs into SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control interface; 4
Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This equipment is used to collect bare PCBs at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Delavan, Wisconsin USA | Production
*Set up printers, placement machines and reflow ovens for production. *Adjust machine parameters and CAM programs *Optimize part placement and feeder applications through CAM programs *Manipulate SPC data for solder paste height measrurements and int
Career Center | Exton, Pennsylvania USA | Production
Job Description: +Program and effectively operate Surface Mount Technology equipment. +Run usage and failure reports on each work order. +Maintain trouble shooting log. +Check machinary often so it can be and is operated in a safe manner. +
Career Center | Stouffville, Ontario Canada | Management
95% on time delivery. Measures daily manufacturing performance versus plan, and work with manufacturing and engineering to determine and communicate corrective actions to maintain on-plan performance. Develops and maintains inventory management sys
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
SMTnet Express, December 6, 2018, Subscribers: 31,514, Companies: 10,684, Users: 25,477 Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates Credits: DfR Solutions The multilayer ceramic capacitor (MLCC) has become a widely used
| https://www.smtfactory.com/I-C-T-SS330-Off-line-Selective-Wave-Soldering-Machine-pd43471093.html
SMT PCB Loader SMT PCB Conveyor Pcb Loader Machine Hot Air Reflow Oven SMT Machine PCB Conveyors SMT Conveyor PCB Linking Conveyor PCB Reflow Oven PCB handling equipment loading Share to: I.C.T-SS330
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=2
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
