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Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
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Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2021-07-19 16:39:47.0
As today's board complexity increases with more components and joints, higher density, and shrinking package technologies, X-ray inspection is integral to identify manufacturing errors. Understanding the significance of this process, Altus continues to add to its equipment offering with the most advanced inspection systems like X-Spection 6000 which has led to new business.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
SMTnet Express, October 17, 2019, Subscribers: 32,268, Companies: 10,900, Users: 25,212 Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints Credits: Alpha Assembly Solutions Despite being a continuous subject of discussion
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
