Industry Directory | Other / Distributor / Manufacturer
Distributor of ERSA soldering equipment and Martin BGA rework station.. Supply all ESD product.. Also distributor for Thermaltronics soldering station..
Industry Directory | Manufacturer
We are Malaysia Public Listed company subsidiary with capability in BGA, Reworking, Reballing, X-Ray, SMT, 0402 Chip, AI, ICT and F/A. We are ISO 9001 certified with RoHS Compliant and LMW status which is for free tax to service oversea customers.
We are subsidairy of Malaysia Public Listed company with capabilities in BGA, SMT, 0402 chip, AI, ICT, MI & F/A from contract manufacturing to turnkey or consigment as customer requirement. We are ISO9001 2000 certified with RoHS conformance and LMW
Industry News | 2016-02-10 15:50:38.0
SMTA is excited to announce the finalized program and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia.
Industry News | 2017-02-05 10:18:08.0
The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.
Career Center | Bukit mertajam, pulau pinang Malaysia | Engineering
SKILL Computer Design AutoCAD, Cad Cam, Adobe Photoshop & PageMaker, CorelDraw, FrontPage, Macromedia Flash Computer Office Ms. Word, Ms. Excel, Power Point. Language Indonesia, English. Type Spee
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/aci-technologies-2-day-techexpo
: Circuit board cleaning and conformal coating (Nordson MARCH and Nordson ASYMTEK) BGA rework using infrared and hot air techniques (PDR) Increasing BGA robustness with BGA underfill
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Shatil Haque, Lumileds Lighting (Malaysia) Sdn. Bhd. "Packaging of High-Power LEDs Using Au Stud Bump Interconnects" 2004: Chrys Shea, Cookson Electronics "Optimizing Stencil Design for Lead-free SMT Processing" 2003
