Industry News | 2011-07-27 22:32:31.0
IPC will host the IPC Executive Summit, “Succeeding in a Disruptive Environment: From Earthquakes to Nanoparticles,” on October 4-5, 2011, in San Jose, Calif.
Industry News | 2017-09-12 20:06:12.0
IPC – Association Connecting Electronics Industries® is joining with a broad coalition of industry groups in support of the U.S. Environmental Protection Agency’s (EPA’s) implementation of a new chemical safety law.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
250,000 square foot printed circuit assembly facili
SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a
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. Many companies are looking into the potential of automation and machine learning programs to help smooth out the transition. Manufacturers in the U.S. face plenty of obstacles and have been hit hard during the COVID-19 pandemic, however; companies that
| https://www.smtfactory.com/saudi-arabia-led-factory-upgrade-driven-by-the-belt-and-road-environment.html
. All the raw materials of LED lights are imported from China, including assembled LED and drivers. From the benefits of the Belt and Road Initiative in recent years, coupled with the inclination of tariffs, self-production of SKD and LED has become the trend of all LED assembly companies
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