Industry Directory | Manufacturer
Our company provides a wide spectrum of services including electronic contract manufacturing, engineering consultants, final packaging and distribution.
New Equipment | Assembly Services
We are SMT and PCB Assembly service in Indonesia. ISO Certification with high quality working standard. Orders welcome from foreign and local manufacturer
New Equipment | Assembly Services
We are SMT and PCB Assembly service in Indonesia. ISO Certification with high quality working standard. Orders welcome from foreign and local manufacturer
Electronics Forum | Thu Jun 22 14:57:34 EDT 2000 | Lee
Mike, when you ask if companies afford to place additional environmental constraints on the manufacturing process, perhaps we should ask whether they can afford not to pay attention to environmental issues. I know this sounds a little flippant, but i
Electronics Forum | Wed Oct 13 12:43:28 EDT 2004 | faiton
Hello! As Stefan mentioned and I agreed. I had been in Japan quite a few times to visit both equipment manufacterer and production company. Most of the work was done by robots and the operator could control from 4 lines up by himself. However, the
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Technical Library | 2021-06-02 19:39:14.0
With an estimated value creation potential for manufacturers and suppliers of USD 3.7 trillion in 2025,1 high hopes are set on Industry 4.0 to bring the next industrial revolution to discrete manufacturing. Yet, only about 30 percent of companies are capturing value from Industry 4.0 solutions at scale today. Approaches are dominated by envisioning technology development going forward rather than identifying areas of largest impact and tracking it back to Industry 4.0 value drivers. Further governance and organizational anchoring are often unclear. Resulting hurdles related to a lack of clarity regarding business value, limited resources, and an overwhelming number of potential use cases leave the majority of companies stuck in "pilot purgatory."
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-
Watch this video to see how evenly flux is applied, cost savings add up and maximizing topfill using the SonoFlux EZ.
Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,
Auburn University Student Chapter Event: Get Hired in Electronics Industry
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com What Is SMTnet and How Can It Assist Your Company? What Is SMTnet
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 3, (#ts#)) SMT Express, Issue No. 6 - from SMTnet.com Volume 1, Issue No. 6 Wednesday, November 24, 1999 Featured
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/medical
& Development From concept to launch and beyond, we have the flexibility to partner with companies of all sizes to develop a design that meets your requirements
| https://www.eptac.com/blog/mastering-quality-standards-ipc-620-certification-in-electronic-manufacturing
. The central reason behind the IPC 620's revered status in the electronic manufacturing industry stems from its impact on quality assurance such as a significant improvement in production quality and
