Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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Industry Directory | Equipment Dealer / Broker / Auctions
Maynards Europe is an European industrial auctioneer based in Germany and part of the global Maynards Industrial Group. We're selling high quality, preowned machines and equipment from all kind of industries.
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Used SMT Equipment | AOI / Automated Optical Inspection
CR Technology RTI 6520 AOI machine PCB Inspection System Approx. Dimensions: 60" x 58" x 80" Item Location: Laval, QC Canada
Used SMT Equipment | Soldering - Reflow
HEXI, Lead-Free reflow soldering machine, type RFN1020/N, s.n. 0611018, Left to Right, with 10 heating heads plus cooling head, lenght of heating zones 3365mm,max width of PCB 450 mm, width of conveyor 50 to 450 mm, height of conveyor 920 +/_ 20 mm,
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ON DEMAND | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Sat Nov 30 18:30:00 UTC 2024 - Mon Dec 30 18:30:00 UTC 2024 | Lewisville, Texas USA
BGA Rework Station Showroom Open House
Events Calendar | Wed Jun 07 18:30:00 UTC 2023 - Wed Jun 07 18:30:00 UTC 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | New York City, Bronx, New York USA | Technical Support
2 to 5 years exp. as machine operator / technician of PCB manufacturing equipment. To 5 years experience hands on mechanical and electrical troubleshooting of PCB manufacturing equipment (preferably Universal Instruments). SMT / TH process knowledge.
Career Center | , | Production
Western Massachusetts based electronic contract manufacturer of PCB Assemblies seeks experienced (2-4 years minimum) SMT Machine Operator. Job requirements are: Operate, maintain and program Automated and Semi-Automated equipment used in Printed Ci
Career Center | San Pedro, Laguna Philippines | 2001-02-06 07:34:16.0
1998�present Japan-Philippine Nameplates Inc. Lot 9 Block 13 CEPZ, Rosario, Cavite PCB Design Engineer Designed multi-layer boards. Designed PC Boards for CANON, NEC, EPSON, SONY, FUJITSU, MITSUBISHI, ROHM, NISSEI ELECTRONICS, etc. 1998�1999 PCB Des
Career Center | , Laguna Philippines | 2001-02-06 07:39:08.0
1998�present Japan-Philippine Nameplates Inc. Lot 9 Block 13 CEPZ, Rosario, Cavite PCB Design Engineer Designed multi-layer boards. Designed PC Boards for CANON, NEC, EPSON, SONY, FUJITSU, MITSUBISHI, ROHM, NISSEI ELECTRONICS, etc. 1998�1999 PCB Des
SMTnet Express, December 12, 2024, Subscribers: 25,959, Companies: 12,335, Users: 29,393 █ Electronics Manufacturing Technical Articles Cleaning No-Clean Fluxes Prior to Conformal Coating A customer called the Helpline seeking advice
SMTnet Express, October 12, 2023, Subscribers: 25,126, Companies: 11,922, Users: 28,420 █ Electronics Manufacturing Technical Articles PCB design guidelines for MEMS sensors This technical note provides PCB design guidelines
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_wave_solder.html
SMT & PCB Equipment, Wave Solder Machines SMT & PCB Wave Solder Machines Electrovert Wave Solder Full Information SOLD Lead Free
Imagineering, Inc. | https://www.pcbnet.com/company/
USA PCB Manufacturing | Imagineering Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
