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#Contact# Unik You unik@cambia.cn +86 18030205725 *1: A Zener barrier is not allowed to be connected with this module. Use an isolation barrier when the module is used in intrinsically safe application. *2: The module input resistance
Electronics Forum | Mon Nov 08 13:14:35 EST 2010 | rway
If you are just wanting to test the values of the electrolytics or tantalums, it's not a problem with an ICT, as long as your system has an analog instrument to do it. If you are wanting to test the polarity of the cap, you will need a capacitive co
Electronics Forum | Mon Aug 29 13:01:57 EDT 2005 | stalkerb
PR thankyou for your feedback, your comments are extremely helpful. We have a customer product porfolio of about 900 active products, covering approx 700 different fabs. your comments are absolutely valid with regards to Speed, however in our scena
Industry News | 2022-01-03 07:42:02.0
IPC Releases EMS Industry Results for November 2021
Industry News | 2022-04-28 14:20:24.0
IPC releases PCB industry results for March 2022
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 87, (#ts#)) SMT Express, Special Edition, Issue 1 - from SMTnet.com Special Edition Issue 1 Featured Article Return
| https://www.wesource.com/miscellaneous/volteq-hy1503d-15v-3a-regulated-adjustable-linear-dc-power-supply/
Samsung Feeders Fluid and Epoxy Dispensers Hand Tools ICT/In-Circuit Test Lead Formers and Cutters Material Handling Equipment Microscopes and Accessories Miscellaneous Optical and Laser Ovens PC Board
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
(solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2
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