Electronics Forum | Tue Nov 04 12:45:54 EST 2008 | smt123
Hi Martin, Have you considered printing the flux with a stencil? Stencils can be used for printing more than just solder paste. Quite regularly people use stencils for printing thermal grease, fluxes, conductive epoxy and more. The thing I like
Electronics Forum | Tue Nov 04 04:00:38 EST 2008 | Martin
Hi All, Anybody knows good, repetable method of dispensing flux for micro BGA rework? 6x6 mm(0.5 mm pitch) The flux dispensing amount by brush may vary depending on operator etc. If operator dispense too much flux the BGA "swim".Around the BGA compon
Industry News | 2014-10-28 19:14:24.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2008-08-14 13:20:36.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Technical Library | 2013-07-11 15:22:40.0
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 2nd Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday –Thursday 3:30pm – 1:00am, Friday 2:30pm to 11:00pm Job Description: Performs a variety of dut
SMTnet Express, August 30, 2018, Subscribers: 31,289, Companies: 11,033, Users: 25,137 Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue Eric Bastow; Indium Corporation No-clean solder pastes are widely
SMTnet Express, June 11, 2015, Subscribers: 22,861, Members: Companies: 14,392 , Users: 38,338 Solder Paste Stencil Design for Optimal QFN Yield and Reliability B. Gumpert; Lockheed Martin Corporation The use of bottom terminated components (BTC
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/technical_committee.cfm
. Raiyo Aspandiar, Ph.D., Intel Corporation - Conference Director Richard Coyle, Ph.D., Nokia Bell Labs - VP of Technical Programs Dudi Amir, Intel Corporation Martin Anselm, Ph.D
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years
