Industry Directory | Manufacturer
Manufacturer of rework and reballing systems, hand soldering solutions, and micro-dispensing technologies
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
Electronics Forum | Mon Nov 25 12:57:29 EST 2002 | caldon
Maxtim- I have used APE's Sniper, airvac, Mecal's 3500, PDR, Pace, and MArtin's rework stations. APE Sniper does the Job but to much automation and not user friendly software. PDR is to much IR and no convection. Metcal's work good now with the ne
Electronics Forum | Tue Feb 05 20:31:39 EST 2013 | hegemon
Air Vac DRS25. Hands down the best rework EQ. (my humble opinion, based on my own experience with rework EQ going back 15 years +) Right in your budget. Complete capability for rework. SMD, BGA, POP. Full profiling capability. Massive bottom heati
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Technical Library | 2007-04-05 13:48:50.0
Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Title: Assembler 2 – IPC 620 – 2nd Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$17 Hours: 9/80 schedule Monday –Thursday 3:30pm – 1:00am, Friday 2:30pm to 11:00pm Job Description: Performs a variety of tas
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 620 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Performs a variety of tas
Career Center | Gainesville, Georgia USA | Production,Quality Control
SKILLS/ATTRIBUTES: Strong mechanical background in building computers and systems. Experienced in soldering, assembly, and quality control techniques. ISO 9001:2000 production department. Experienced with computer, cable, mechanical and electroni
Career Center | Melbourne, Florida USA | Engineering
I have over 24 years experience in the PCB manufacturing arena. My career knowledge is in most SMT manufacturing equipment. Creating and troubleshooting manufacturing assembly processes and creating detailed work instructions using Microsoft Power
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
(01005, Leadless Components, PoP) Rework Reliability Robotic Soldering Selective Soldering Solder Jetting Solder Paste/Solder Voids in Joints Solderless Interconnections Supplier Engineering Thermo Compression Bonding Underfill
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/pcb-and-smt-assembly
. Failure Protection with Underfill Many large components, such as Package-on-Package (PoP), ball-grid arrays (BGA) and chip-scale packages (CSP
