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Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
| https://www.eptac.com/wp-content/uploads/2015/02/eptac_03_18_15-1.pdf
Heller Industries Inc. | https://hellerindustries.com/tombstoning/
: Improper pad design Improper pad trace Improper solder mask application Via in pad draining solder from connection Trace with solder mask over it running under component causing a fulcrum effect on
