Electronics Forum | Mon Jan 19 12:56:36 EST 2009 | alien
Proper Prior Preparation Prevents Piss Poor Performance. I am on the customer side, but have a pretty good idea on what has to happen on the assembly side. TALK TO YOUR CUSTOMER, TELL HIM IN ADVANCE WHAT YOU NEED !!! PCB fab takes at least one day
Industry News | 2022-09-26 06:59:48.0
EasySpheres received a 2022 Mexico Technology Award in the category of Solder Spheres for its Tape-and-Reel Spheres. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2016-02-02 12:18:54.0
Gen3 Systems Limited is pleased to announce that it will exhibit in Booth E19 at Southern Manufacturing, scheduled to take place Feb. 9-11, 2016 at FIVE in Farnborough, Hampshire.
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
SMTnet Express, September 16, 2021, Subscribers: 26,691, Companies: 11,438, Users: 26,841 Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards Mathematical model for dynamic force analysis of printed circuit
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
, Ph.D., Nihon Superior Co. Ltd.) 2017: Chrys Shea, Shea Engineering Services (Co-author: Ray Lawrence, 4Front Solutions) " Solder Paste Qualification Testing for EMS Production " 2016