Electronics Forum: mathematical formula for predicting solder balling (1)

Quick Turn Around for an EMS Provider - Brainstorming

Electronics Forum | Mon Jan 19 12:56:36 EST 2009 | alien

Proper Prior Preparation Prevents Piss Poor Performance. I am on the customer side, but have a pretty good idea on what has to happen on the assembly side. TALK TO YOUR CUSTOMER, TELL HIM IN ADVANCE WHAT YOU NEED !!! PCB fab takes at least one day

Industry News: mathematical formula for predicting solder balling (4)

EasySpheres Wins Mexico Technology Award for Tape-and-Reel Solder Spheres

Industry News | 2022-09-26 06:59:48.0

EasySpheres received a 2022 Mexico Technology Award in the category of Solder Spheres for its Tape-and-Reel Spheres. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.

EasySpheres LLC

Gen3 Systems Announces Product Lineup for Southern Manufacturing

Industry News | 2016-02-02 12:18:54.0

Gen3 Systems Limited is pleased to announce that it will exhibit in Booth E19 at Southern Manufacturing, scheduled to take place Feb. 9-11, 2016 at FIVE in Farnborough, Hampshire.

Gen3 Systems

Technical Library: mathematical formula for predicting solder balling (1)

Analysis of Laminate Material Properties for Correlation to Pad Cratering

Technical Library | 2016-10-20 18:13:34.0

Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: mathematical formula for predicting solder balling (998)

SMTnet Express - September 16, 2021

SMTnet Express, September 16, 2021, Subscribers: 26,691, Companies: 11,438, Users: 26,841 Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards Mathematical model for dynamic force analysis of printed circuit

Partner Websites: mathematical formula for predicting solder balling (31)

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

, Ph.D., Nihon Superior Co. Ltd.) 2017: Chrys Shea, Shea Engineering Services (Co-author: Ray Lawrence, 4Front Solutions) " Solder Paste Qualification Testing for EMS Production " 2016

Surface Mount Technology Association (SMTA)


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