RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
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Large Format PCB's ACI has made substantial investments in the production of Large Format PCB's. This unique capability allows us to build plated-thru structures up to 24" wide by 102" in length utilizing almost any material type. We produce a vari
Electronics Forum | Wed Aug 04 16:49:24 EDT 2004 | jim_bob
Regarding Lead Free component finishes, vendors are zeroing in on matte tin plating as the finish of choice. What test are performed, to determine if a finish is "matte" type (vs. non-matte)?
Electronics Forum | Tue May 16 16:36:18 EDT 2006 | dougm
Has anyone had issues with chips not making a reliable connection in sockets with a matte tin finish (RoHS compatible)? We have had issues with these types of sockets. I sent some to the manufacturer, and was told there weren't any problems. We re
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2022-10-06 18:05:48.0
IPC announces the first employee of its new legal entity in Germany, Hans-Peter Tranitz, Ph.D. Dr. Tranitz will serve as senior director, Solutions, at IPC Electronics Europe GmbH in Munich. In this role, Dr. Tranitz will focus on IPC global initiatives including automotive electronics, advanced packaging, and Factory of the Future as well as serving as a technical resource for regional activities in Europe.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2008-04-29 15:50:45.0
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb
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