Industry Directory | Manufacturer
Strive Technology is a leader in the manufacture and assembly of printed circuit boards in China. Our services including SMT Assembly PTH Assembly Component Procurement PCB Manufacture BGA Placement.
Industry Directory | Equipment Dealer / Broker / Auctions
Shenzhen Grandtop Automation Co., Ltd ,a manufacture specialized in SMT and DIP processing. products are widely used in industrial equipments,ommunication apparatus, automobile electronics, computers
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Wed Aug 10 16:04:09 EDT 2005 | rrylande
I am concerned about delamination and other modes of damaging the board itself. Am I mistaken to believe that raising the entire board to near reflow temperatures (during the repair of a single BGA) may damage the quality of the board?
Electronics Forum | Wed Aug 10 14:56:03 EDT 2005 | pjc
"Too Hot" is any more heat than what is needed to reflow the solder. You should have the Auto-Profile software for the machine, this will accurately monitor and record temps. There is also port for the component itself to monitor package temp. There
Used SMT Equipment | AOI / Automated Optical Inspection
MIRTEC MV-7U AOI, MV 7 Series In-Line AOI Machine • In Line Type Vision Inspector for Large Boards• Windows 7 Intel Core2 Duo PC• Five Camera In-Line AOI System• 10 MP cameras with ISIS Vision• 13.4 micron um/pixel Telecentric Compound Lenses• Board
Used SMT Equipment | AOI / Automated Optical Inspection
MIRTEC MV-7U AOI, MV 7 Series In-Line AOI Machine • In Line Type Vision Inspector for Large Boards• Windows 7 Intel Core2 Duo PC• Five Camera In-Line AOI System• 10 MP cameras with ISIS Vision• 13.4 micron um/pixel Telecentric Compound Lenses• Boar
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
High Performance Reflow Oven SMT PCB Reflow Soldering Oven Machine Price ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology ex
Low Cost Mini LED SMT Reflow Oven Machine for PCB Reflow Soldering ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Bangalore-85, ka India | Production
As a Sr.Technician involved in production activities like programming, taking care of the production, process, rectifying the process problems, constantly getting in touch with the customers for any quality issues & other production activities, invol
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
”, 31st Annual Electronic Packaging Symposium and Semicon West 2019. [7] W. Lin, “The Void-free Reflow Soldering of BGA with Vacuum”, 2007 8th International Conference on Electronic Packaging Technology. [8] T. Ewald, N. Holle, K. Wolter, “Void Formation
| https://www.smtfactory.com/I-C-T-Lyra622N-Lead-free-SMD-Dual-Rails-Reflow-Soldering-Oven-Machine-pd46059734.html
. First, solder paste is applied to PCBs. Then, the PCBs pass through the reflow oven, where the solder paste is heated to melt and create secure connections between components and the PCB. Finally, the assembly is cooled, solidifying the solder joints. Q