Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
New Equipment | Assembly Services
JUKI RS-1XL SMT Assembly Line JUKI RS-1XLSMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 29000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machi
Heller 2156 MK7 SMT Reflow Oven Heating Zones: Top 17/ Bottom 17PCB Width:50 - 560 mmLength: 869cmProduct description: Heller 2156 MK7 SMT Reflow Oven, Heating Zones: Top 17/ Bottom 17, PCB Width:50 - 560 mm, Length: 869cm Heller 2156 MK7 SMT R
Electronics Forum | Thu Mar 15 21:09:07 EDT 2007 | KEN
Cecil, the board is a component.
Electronics Forum | Thu Mar 15 10:28:46 EDT 2007 | cecil
Just askin but why would someone even want to subject an assembly to even 6 reflow cycles? As far as how many cycles that an assembly can be subjected to, wouldn't that be determined my your components?
Used SMT Equipment | Soldering - Reflow
“Sealed Bid” Auction Bidding Opens On February 9, 2015 At 8AM EST Bidding Closes On February 24, 2015 Promply At 5PM EST ** This Is Not An Ebay Style Auction ** ** It Is A Sealed Bid Auction ** ** Bidders Should Submit Maximum Bids When Ente
Used SMT Equipment | Pick and Place/Feeders
Product number: YSI- v Products in detail Object substrate: L50 W50mm ~ L330 W360mm xx (1) does When using standard components: absoluteaccuracy (including + 3 sigma) : + / - 0.05 mm/QFP Repeat accuracy (3 sigma) : + / - 0.03mm/QFP SMT capacity:
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Yamaha YC8 Chip Shooter Compact Modular Odd Form Placement ❙ Features of Yamaha SMT YC8 Odd Form Placement Yamaha compact modular PCB chip shooter, Yamaha SMT chip shooter machine, applicable PCB size, L50 x W50mm to L330 x W360mm, YC8 Odd For
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Newbury Park, California USA | Engineering,Maintenance,Production,Quality Control
MUST BE: Proficient with Stencil Print Operations. Familiarity with SMT component types and packages. Ability to read and understand procedure document and work instructions. Operate fully automated SMT, Surface Mount Lines including: Screen Pr
Career Center | Bolingbrook, IL USA | Engineering
Technical support of SMT processes in manufacturing including troubleshooting of equipment, defect analysis, resolution of component or materials issues and process improvements. You will source, implement and document new manufacturing equipment, t
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
| http://etasmt.com/te_news_bulletin/0/0.chtml
system with over 4 meter process length is economically priced and made for maximum quality at minimal manufacturing cost... Show Details Highlights Reflow System Ersa HOTFLOW 3/14 HOTFLOW 3/14 The 7 zone reflow oven offers highest throughput, optimized energy balance, best process control and maximum machine uptimes
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_reflow_ovens_heller1088.html
Heller 1088 EXL Reflow Oven SMT PCB Heller 1088 EXL Reflow Oven Model Number: 1088EXL Serial Number: 0201DA1A1-53956 Year: Feb 2001 Left to Right Process Flow 8 heating zone forced convection reflow system with 4 heaters above and below the conveyor Extra High Volume heating modules with maximum safe velocity gas glow
