Industry Directory | Manufacturer
We offer you the services in working out and manufacture of the widest spectrum of radio-electronic products. Our manufacture is ready to render services in assembly and test of PCB.
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New Equipment | Assembly Services
JUKI RS-1XL SMT Assembly Line JUKI RS-1XLSMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 29000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machi
Electronics Forum | Thu Mar 15 21:09:07 EDT 2007 | KEN
Cecil, the board is a component.
Electronics Forum | Thu Mar 15 10:28:46 EDT 2007 | cecil
Just askin but why would someone even want to subject an assembly to even 6 reflow cycles? As far as how many cycles that an assembly can be subjected to, wouldn't that be determined my your components?
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2018-10-18 10:12:06.0
Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Technical Library | 2019-12-26 19:13:52.0
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Yamaha YC8 Chip Shooter Compact Modular Odd Form Placement ❙ Features of Yamaha SMT YC8 Odd Form Placement Yamaha compact modular PCB chip shooter, Yamaha SMT chip shooter machine, applicable PCB size, L50 x W50mm to L330 x W360mm, YC8 Odd For
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
Featured Article Return to Front Page REFLOW SOLDERING
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
”, which can be ordered directly from us. More SolderTips Visual Acuity Requirements for Soldering PEM® Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners Have a question
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
in both components. A significant number of the observed voids exceeded the IPC-JSTD-001 maximum void size criteria. ▪ X-ray and metallographic inspections showed that subsequent vacuum reflow processing eliminated virtually all the voiding in both
