New SMT Equipment: maximum thermal cycles per pcb (19)

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

PTI-500 First Article Inspection Tester

PTI-500 First Article Inspection Tester

New Equipment | Inspection

PTI-500 First Article Inspection Tester 版本号:PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be

Qinyi Electronics Co.,Ltd

Electronics Forum: maximum thermal cycles per pcb (21)

Number of thermal excursions per componet

Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef

BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar

Re: Thermal excursion

Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F

AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p

Used SMT Equipment: maximum thermal cycles per pcb (3)

SMTmax F6

SMTmax F6

Used SMT Equipment | Soldering - Reflow

SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-f

elite machine

Vi Technology 5K SPECTRO 3D Automated Optical Inspection Machine (2016)

Vi Technology 5K SPECTRO 3D Automated Optical Inspection Machine (2016)

Used SMT Equipment | AOI / Automated Optical Inspection

VI Technologies 3D AOI machine (2016) Type: 5K SPECTRO Large Board AOI Solution 230V, 690 Watts, 3 Amps, 50 Hz lightly used unit 3D Single Lane Automated Optical Inspection System Precision XY gantry High-speed linear motors with closed loop

Tekmart International Inc.

Industry News: maximum thermal cycles per pcb (39)

Card-to-cable Connector Meets QS9002 Standard

Industry News | 2003-02-20 08:04:10.0

The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.

SMTnet

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

Technical Library: maximum thermal cycles per pcb (3)

A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism

Technical Library | 2019-12-26 19:13:52.0

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.

Beihang University

Heat Sink Induced Thermomechanical Joint Strain in QFN Devices

Technical Library | 2024-07-24 00:51:44.0

A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.

IBM Corporation

Videos: maximum thermal cycles per pcb (19)

Electrovert Reflow Soldering

Electrovert Reflow Soldering

Videos

The Electrovert® OmniMax/ES ™ series reflow soldering system is designed to deliver maximum thermal performance combined with process capability and control. The OmniMax/ES platform offers a combination of industry proven technologies in an easy to u

ITW EAE

MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.

MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.

Videos

MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.

ITW EAE

Career Center - Resumes: maximum thermal cycles per pcb (2)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Express Newsletter: maximum thermal cycles per pcb (969)

Partner Websites: maximum thermal cycles per pcb (147)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

thermal expansion (CTE) mismatch between the package and the PCB [20, 21]. The CTE of the PCB was measured using a thermomechanical analyzer (TMA) and the composite coefficients of thermal expansion of the 192CABGA and 84CTBGA packages were measured using

Heller 公司

PCB Footprint Expert for OrCAD PCB

PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/OrCAD-PCB.asp

PCB Footprint Expert for OrCAD PCB   LOGIN   Downloads About Footprint Expert Parts Forum Distributors Sales & Support About Us News History Altium Designer CircuitStudio P-CAD Allegro OrCAD Layout OrCAD PCB Board Station PADS Standard PADS Professional Xpedition VX CADSTAR CR-5000 / 8000 eCADSTAR 3D STEP

PCB Libraries, Inc.


maximum thermal cycles per pcb searches for Companies, Equipment, Machines, Suppliers & Information

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Precision PCB Services, Inc
Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

1750 Mitchell Ave.
Oroville, CA USA

Phone: (888) 406-2830