Electronics Forum | Wed Sep 03 12:29:47 EDT 2008 | omid_juve
That could lead to oxidation of the leads and > worsen solderability. It's much better to make > sure the components are handled properly and not > exposed to moisture. > > The reason for baking is > moisture in the body not in the leads. > > W
Electronics Forum | Thu Feb 27 15:13:35 EST 2003 | stockley
Oh dear, I tried not to respond but i couldn't help myself. Stop me if I go off into the woods. My guess, Chris, based on your fleeting reference to GF files, is that your SMT machines are Siemens Siplace. If this is so then package orientation def
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SIPLACE Grand Opening in Atlanta
Industry News | 2010-06-23 11:36:12.0
Siplace presented a solution to NOTE satisfying their wide ranging needs
