Ellsworth Adhesives has trained adhesive application specialists available to assist you with any requirements or questions that you may have related to adhesives, sealants, coatings and tapes, or the dispensing of them.
Industry Directory | Manufacturer
United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Tue May 12 07:26:16 EDT 2009 | emmanueldavid
Jorge, The basic thumb rule to measure Adhesive Strength remains as bonded Chips at Post Reflow should not move around or misplace when Your Thumb Finger try to do so which called as Thumb Force Test. However as Dave stated, there are various Stre
Electronics Forum | Mon May 11 12:15:46 EDT 2009 | jorge_quijano
Hi, I just want to know how to measure the strength of a 0603 after it's cured, we are using Heraeus PD944 with a 30-7 mils stencil, glue depositions looks well, but I don't know how to measure it? Thanks
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | General Purpose Test & Measurement
The Aeroflex 6843 spectrum analyzer is a wide band 20GHz sensitive receiver. It works on the principle of "super-heterodyne receiver" to convert higher frequencies (normally ranging up to several 10s of GHz) to measurable quantities. The received fre
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Pick and Place/Feeders
TOOL FOR ADHESIVE MEASURING SCALE S50
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | Williamsport, Pennsylvania USA | Accounting/Finance,Engineering,Management,Production,Purchasing,Quality Control,Sales/Marketing
Spartronics is more than just a company. We have great facilities, a dedicated and talented team, tremendous capacity and capabilities, and longstanding customers who need us. Now, it’s all about driving forward with a winning strategy that bui
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Sungai Ara, Penang Malaysia | Management,Sales/Marketing
Spoken skills : English, Malay, Chinese, Cantonese, Korean (Basic) Writing skills : English, Malay, Chinese, Korean (Basic) Computer skills : Microsoft Office (Word, Excel, PowerPoint) Personal : Sense of responsibility, quick learner, can work in
SMTnet Express, January 7, 2016, Subscribers: 23,975, Members: Companies: 14,885, Users: 39,703 Effect on Microwave Plasma Surface Treatment for Improved Adhesion Strenght of Direct Copper Plating on PTFE Akira Takeuchi, Takahiro Kurahashi
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/about-adhesives/sustainability/measure
Sustainability - Measure Adhesive Dispensing Systems Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories - Auxiliary Equipment
ORION Industries | http://orionindustries.com/pdfs/300lse.pdf
: Technical Data September, 2002 Tape 9453LE Tape 9471LE Tape 9472LE Adhesive: 3.6 mils (91 microns) 2.3 mils (58 microns) 5.2 mils (132 microns) (Solvent Free) 3M High-strength 3M High-strength 3M High-strength Acrylic Adhesive Acrylic Adhesive Acrylic Adhesive 300LSE 300LSE 300LSE Liner
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