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New Equipment | Industrial Automation
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Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2013-10-09 08:35:53.0
SEHO Systems GmbH will exhibit in Hall A4, Stand #578 at the Productronica International Trade Fair in Munich, Germany.
Parts & Supplies | Pick and Place/Feeders
JUKI 2050 machine failure solution KE2050M Z-axis fault E620014 error handling method! Suddenly heard the sound of the machine. The machine stopped the fault for the E620014Z axis drive alarm. View the drive. For Z drive 1, the third light is on
Technical Library | 2020-07-02 13:29:37.0
Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
Career Center | Clarksburg, Maryland | Engineering
Immediate opportunities for SMT Solder Specialist. Also have these positions open. All immediate opportunities: Assembler: Must have strong electro mechanical manufacturing skills. Experience with assembly of electro mechanical products in a high
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
number and temperature of the chamber at the time of the event. Once a solder joint recorded 15 events in this format the component was considered to be failed and the event detection system software excluded it from the remainder of the test (i.e. event
| https://www.smtfactory.com/Development-Stage-of-SMT-Pick-and-Place-Machine-id47535177.html
pick and place: Accurately measure and control the pick and place force through the Z dimension, so that the components are in good contact with the solder paste, or use APC to control the pick and place position to ensure the best soldering effect. ●The
