Industry Directory | Manufacturer
Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.
Industry Directory | Consultant / Service Provider / Training Provider
ERI is a specialized engineering school, focusing on the reliability and durability of hardware, upon the kinds of stresses that can shorten the life of hardware such as yours and upon appropriate tests to uncover weaknesses.
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Streamtek Electronics provide HiRel SMD Packages. Standard products include SMD-2, SMD-1, SMD-0.5, SMD-0.2, TO263 package, SMD-FP Package and customized packages with similar configuration. These packages are complied with MIL-PRF-19500, MIL-STD-750,
Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Technical Library | 2007-04-18 19:23:22.0
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Career Center | , Massachusetts | Engineering
we are looking for a mechanical engineer with the following qualifications: * BSME * US Citizenship * Pro-Engineer / Pro-Mechanica experience * Military electronics packaging background * Thermal and Structural Analysis (Shock, Vibe) analys
Career Center | Rochester, New York USA | Engineering
Our high tech client located in the Western NY State area offers you the following challenge. Complete mechanical design responsibility from specification to the manufacturing process. We seek a candidate that has the following experience: Design
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
SMTnet Express, June 26, 2014, Subscribers: 22868, Members: Companies: 13912, Users: 36398 Enhancing Mechanical Shock Performance Using Edgebond Technology Steven Perng, Tae-Kyu Lee, and Cherif Guirguis; Cisco Systems , Edward S. Ibe; Zymet
KingFei SMT Tech | https://www.smtspare-parts.com/sale-35399835-ysm10-shock-absorbers-klw-m3t0d-00-smt-spare-parts-for-ysm20r-machine.html
YSM10 Shock Absorbers KLW-M3T0D-00 SMT Spare Parts For YSM20R Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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. Burn-in a test board with thermal shock and mechanical shock to check the board’s reliability. Compare real-time thermal data with the virtual profile
