Industry Directory | Consultant / Service Provider / Manufacturer
Mat-tech is your specialist in high-tech soldering & brazing. Whether it's developing a new product or improving an existing product, we provide the perfect joint.
Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
SMT Lead Free Wave Soldering Machine XMW-350 Wave soldering advantages: ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes. Intelligent: intelligent control software, memory process parameters
SMT Lead Free Wave Soldering Machine XMW-450 Feature ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes Intelligent: intelligent control software, memory process parameters, automatic heating
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Technical Library | 2016-08-24 06:15:35.0
From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
I.C.T AI-5146W Automatic PCB Test Optical Inspection AOI Machine for PCB Overview Introduction: DIP On-line Dual side AOI AI-5146W (After THT Soldering) I.C.T DIP dual side AOI captures board image in real time by high precision color ind
The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly develo
Events Calendar | Mon Apr 05 18:30:00 UTC 2021 - Mon Apr 05 18:30:00 UTC 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Career Center | Arlington, Texas USA | Engineering,Research and Development
Microelectronics packaging and reliability engineer with three years experience as a post doc. researcher currently conducting several industry oriented projects including: - Development of mechanical bending fatigue test for BGA solder joint evalua
Career Center | Redondo Beach, California USA | Engineering,Production,Research and Development,Technical Support
Program and operate automated manufacturing and testing equipment for printed wiring boards. Assist engineers and supporting staff in the process of manufacturing and testing printed wiring boards. Involved with engineers in the qualification of manu
SMTnet Express, March 7, 2019, Subscribers: 31,716, Companies: 10,725, Users: 25,814 Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints Credits: DfR Solutions Electronic assemblies use a
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
Solder Joint Reliability, or SJR, is the ability of solder joints to remain in conformance to their visual/mechanical and electrical specifications over a given period of time, under a specified set
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