Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
Industry Directory | Manufacturer
Modular pick and place automation - tape and reel - tube feeder - coplanarity check - assembly machine - contactless pick and place
New Equipment | Rework & Repair Equipment
The unique Beau Tech spudgers are made of special vulcanized fiber which has the most desirable mechanical, electrical, and thermal properties for applications on printed circuit boards.
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
Electronics Forum | Wed Aug 05 12:13:50 EDT 2015 | swiese242
Find someone that has a 3D Printer and create a top and bottom jig that will hold them down. This has worked for our production needs in many ways and has saved us thousands instead having a metal shop create one. www.avcomsmt.com
Electronics Forum | Wed Jun 24 21:34:02 EDT 2015 | kennyg
I am struggling with a water wash process for a very small (1"x1") PCB. It has components that are very esily damaged by contact. I'm stuck with wash. I know, I know, but no-clean isn't an option. We put the board in s compartmentalized wash basked
Used SMT Equipment | Pick and Place/Feeders
Assembleon Opal X II SMT Pick & Place Type: PA131404 NC: 946601314041 This lot also includes: (20) 8mm OPAL FEEDERS Serial: FFPB709Y10257 Features: 8-Head Hours: 19452 200-416V 3 Phase AC 50/60Hz 4.4KVA CE Marked Note: Machine uses mechan
Used SMT Equipment | SMT Equipment
FUJI, Modular Pick&Place Machine,with unique logic module QP242E-ICM-101, 5 modules total, with 4 feeders support, 31 slots/each, 1 trays slot for 20 related plate, for both electronic or mechanic feeders, 48.618 working hours, software version 3
Industry News | 2015-10-29 12:52:22.0
Whizz Systems Inc., in partnership with Cypress Semiconductor and Place Global, is proud to unveil Helio, the world's first solar powered beacon.
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Parts & Supplies | SMT Equipment
Wiping mechanism snaps ears(001527) Product Name: 001527; wiping mechanism snaps ears Part Number: 001527 Applicable models: UP2000, AP class machines 001527 wiping mechanism snaps ears
Parts & Supplies | SMT Equipment
Wiping mechanism snaps ears(001527) Product Name: 001527; wiping mechanism snaps ears Part Number: 001527 Applicable models: UP2000, AP class machines 001527 wiping mechanism snaps ears
Technical Library | 2022-01-28 02:19:23.0
This white paper provides an overview of the design and development process for the various hardware components that make up the 5G ORU white box. Whizz Systems is responsible for the electrical, thermal, mechanical engineering, and manufacturing aspects, as well as system validation and bring up of the turn key white box ORU solution.
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Tue Apr 14 00:00:00 EDT 2020 - Tue Apr 14 00:00:00 EDT 2020 | ,
Why Are We Cleaning No-Clean?
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 8 years of mechanical design in the areas of moving components, gears, bearings, and electro/mechanical parts. Electronic packaging, can come from the toy industry, copiers, or printers. Duties/Functions: Will work closely with
Career Center | San Diego, California USA | Production
VAN D THACH 4471 54th Street, San Diego, CA 92115 Home phone: (619) 453-3877 Email vanth11103@yahoo.com RESUME Objective Electrical and Mechanical Assembly. Education _ San Diego City C
Career Center | , New Jersey USA | Engineering,Management,Production,Research and Development
A highly experienced Engineering/Manufacturing Manager with 40 years of experience in electronic/mechanical design and manufacturing. Recent years, specializing in electronic manufacturing with emphasis on Surface Mount Technology. Currently employed
| http://etasmt.com/cc?ID=te_news_bulletin,11361&url=_print
vehicles.Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/screen-changers/flex-disc
) Smaller machine size for same throughput possible Features: Robust design Rheologically optimized Mechanically reinforced Backflushable Reusable Retrofittable High quality filtration media 1
