Industry Directory | Manufacturer
Since 1986, AAT systems have been design-driven by the science of cleaning. Our systems include batch and inline, aqueous and solvent, spray in air, and batch cleaners with ROSE Testing capabilities.
New Equipment | Cleaning Equipment
World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz
New Equipment | Cleaning Equipment
SOLVENT IONIC REGENERATION Increases bath life by removing flux as well as particulate contamination from the wash solution. This provides on average a 300% to 1000% increase in bath life and reduces solvent waste. Ionic regeneration also increases
Electronics Forum | Mon Feb 05 17:39:53 EST 2007 | flipit
Remember, deionized water is very corosive. If the water is too deionized, 10 mega ohm, it will leach the ions from exposed metals. I had a stencil cleaner where the welds completely dissolved. The stainless steel tank was fine but the welds were
Electronics Forum | Mon Apr 06 12:32:20 EDT 1998 | Roxanne Picou
March 31, 1998-Austin, TX --- Austin American Technology announces a new Pre-Wash feature for the Mega� II to operate in conjunction with AAT's patented closed-loop regenerative cleaning process. This feature allows for an optional dual chemistry
Industry News | 2020-08-19 04:10:04.0
Austin American Technology (AAT) is excited to offer existing and new customers large discounts on all Mega ION® and Mega SA solvent batch cleaners due to a surplus of inventory. The machines are all ready for immediate delivery!
Industry News | 2020-10-29 07:36:25.0
Austin American Technology (AAT) is pleased toannounce that it received a 2020 Mexico Technology Award in the category of Cleaning Equipment for its Mega ION® Automated Batch Cleaning System. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express, April 29, 2021, Subscribers: 27,195, Companies: 11,344, Users: 26,617 Failure Analysis – Using Ion Chromatography And Ion Chromatography/Mass Spec (IC/MS) Since the 1980s the electronics industry has utilized ion
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/applications/plasma-treating?con=t&page=1
Plasma Treating and Plasma Surface Treatment | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
Baja Bid | https://bajabid.com/tempo-automation-auction/
: Asys Divisio 2100 Board Router (2018) Wash : Aqua Kleen Typhoon T-20 Inline Wash (2018) Aqueous Technologies Zero-Ion G3-24 Contamination Tester (2017