Industry Directory | Distributor / Manufacturer
An international distributor of mechanical IC samples or "dummy" components, SMD production tools and equipment
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of robotic soldering equipment including contact, laser and ultrasonic soldering available in several robotic platforms including desktop, SCARA, cartesian and six axis multi-articulated robots.
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
Imaging at ACIT assists our scientists with visualizing the failures that have been described. The application of advanced imaging has a wide range of uses in our laboratory. Imaging provides a permanent visual record of samples through each step of
Electronics Forum | Fri Aug 24 08:49:54 EDT 2018 | davef
My first guess at the cause of your components skewing -- Termination pads on the board to not well match the the soldered terminals on the components, causing unbalanced wetting forces on the component terminations while the solder is molten.
Electronics Forum | Fri Aug 24 11:58:18 EDT 2018 | cupet
Hello davef, thank you for your reply. What do you think about the footprint for the diode on the first picture where the component is not assembled? There is good wetting on one pad of footprint and the other pad has bad wetting. This problem is not
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Danville, Illinois USA | Production
http://jobs-watchfiresigns.icims.com/watchfiresigns_jobs/jobs/candidate/job.jsp?jobid=1005&mode=view Overview: Watchfire Signs is a dynamic, exciting place to work. Our process engineers utilize their required Bachelors of Engineering and required
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 90, (#ts#)) SMT Express, Volume 3, Issue No. 12 - from SMTnet.com Volume 3, Issue No. 12 Wednesday, December 19, 2001
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/standard-chip-component-dimensions_topic1729.html
. The Height is the main driver of this component lead form. Issue: if you use a 0603 land pattern considering the highest package, you may be dumping too much solder on an 0603 that is 50
