Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Lead Free SMT Reflow Oven XMR-1000D Product features: ▶fully meet all kinds of lead-free welding process requirements. ▶WindowsXP operating system, English and Chinese interface, easy to learn operation; Standard air furnace, patented hot air system
New Equipment | Solder Materials
Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp3.5™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Electronics Forum | Thu Jan 26 13:13:14 EST 2017 | dyoungquist
What type of solder are you using, Lead or Lead-Free? What is the melting point of it? What temperature are you setting your solder bath to? Possible solutions: 1) Give your solder bath a little more time to even out the temperature across the en
Used SMT Equipment | Soldering - Wave
Features 1. Easy to control every soldering technical parameter . 2. Digital display of soldering temperature. 3. High reliability: high temperature heating element made the machine performance stable and reliable. 4. Widely used: Can rep
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2018-10-18 08:46:25.0
"Lead-Free" Semiconductor Industry
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Technical Library | 2021-05-13 16:03:25.0
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
SMTnet Express, July 1, 2015, Subscribers: 22,969, Members: Companies: 14,445, Users: 38,464 Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi Joseph M. Juarez, Michael Robinson, Joel Heebink; Honeywell International
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/high-temp-soldering/
Blackfox High Temperature Soldering Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
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. The peak temperature is generally determined by the melting temperature of the solder paste and the heat resistance temperature of the PCB substrate and components
