New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Solder Materials
The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang
| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther
Used SMT Equipment | Conveyors
Speedlines Camalot1818 Underfill Agilent SJ 50 AOI Universal GSM PTF Panasonic FCB-2M Flip Chip Bonder Speedlines MPM accuflex Solder Paste Printer DEK 265 GSX Solder Paste Printing Autolink Engineering PTE LTD R4200 Offl
Used SMT Equipment | Soldering - Wave
Features 1. Easy to control every soldering technical parameter . 2. Digital display of soldering temperature. 3. High reliability: high temperature heating element made the machine performance stable and reliable. 4. Widely used: Can rep
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
SMT solder dross recovery system solder waste recycling separator online automatic solder dross separator HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce product
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
SMTnet Express, July 1, 2015, Subscribers: 22,969, Members: Companies: 14,445, Users: 38,464 Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi Joseph M. Juarez, Michael Robinson, Joel Heebink; Honeywell International
| http://etasmt.com/cc?ID=te_news_bulletin,15961&url=_print
. The peak temperature is generally determined by the melting temperature of the solder paste and the heat resistance temperature of the PCB substrate and components
Heller Industries Inc. | https://hellerindustries.com/bit_publications/repeatabilitity-of-the-temperature-profile-under-load-variation/
Repeatabilitity of the Temperature Profile Under Load Variation - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
