Industry Directory | Consultant / Service Provider / Manufacturer
MemoryDealers designs, manufacturers, and markets memory modules for use in Cisco, Sun, Juniper, PCs, laptops, and legacy devices. With distribution centers in the United States, United Kingdom, Korea, and Japan, MemoryDealers provides a total soluti
We carry Elpida memory and running business for more than 10 years. Our closely partner is a DRAM Module and 3C gizmo EMS.
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
Electronics Forum | Tue Jan 05 21:01:40 EST 2021 | brianjones
We are looking at setting up a memory module conveyor belt with a stacker and de-stacker. I will need to handle DDR3 and DDR4 Long DIMM and SODIMM. I will be mounting an image camera under and over the modules. Looks like an edge conveyor would be be
Electronics Forum | Tue Jul 03 09:13:18 EDT 2001 | rstodd
I work for a memory module manufacturer and I am interested in obtaining information on typical first-pass yield numbers and failure rates in the memory module industry for benchmarking purposes. Any information provided would be greatly appreciated
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 100A Reflow Oven Vintage: 2012 LOW HOURS Edge Rail Mesh Belt L to R Flow Programmable Width Adjust Smart Tracker SMEMA Bottom Cooling Fans 480V 3-Phase UPGRADE Kit Recently Added ($13k Value) - Intellimax 2 Module Assembly - Wincon 7.2 So
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Parts & Supplies | Assembly Accessories
After receiving the input signal of home sensor of motor related to head, it is transmitted to can master BOARD.CONVEYOR Control board receive controller The sensor input with ANC and the input of the switch on the operation panel are transmitted t
Parts & Supplies | Chipshooters / Chip Mounters
JUKI 106 NOZZLE E35067210A0 JUKI E9672729B00 MONITOR BRACKET JUKI E96747290B0 COPLANARITY UNIT ASM JUKI E9674729A00 FILTER UNIT JUKI E9674729B00 FILTER UNIT JUKI E9675729000 SENSOR CABLE JUKI E9676729000 VGA SWITCHING UNIT JUKI E9678729000 REAR MON
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
http://www.pcb-separator.com/plus/view.php?aid=85 ??????/PCB?????/???????/Programmable PCB Separator/desktop pcb separator/Professional CNC Router/pcb depaneling router/PCB Separator manufacturer
http://www.pcb-separator.com/plus/view.php?aid=85 ??????/PCB?????/???????/Programmable PCB Separator/desktop pcb separator/Professional CNC Router/pcb depaneling router/PCB Separator manufacturer
Career Center | San Jose, California USA | Engineering
Headquartered in San Jose, as leading PC component distributor and rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR, SD-RAM, SO-DIMM and F
Career Center | San Jose, California USA | Engineering
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR
Career Center | Costa Mesa, California | Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 17yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, Electrovert equipment. Have also done off-
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11658513-heller-1809mkiii-1913mkiii-board-t-c-digitizer-module-tdm-heller-insustries.html
HELLER 1809MKIII 1913MKIII Board T/C Digitizer Module TDM Heller Insustries Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=3DPLUS&PN=2D4G72UB3652
! customer login required - 1 credit Status: Active Mounting Type: Surface Mount Logical Description: IC, 4-Gbit, DDR2 SDRAM Memory Module Physical Description: Ball Grid Array (BGA), 1.27 mm pitch, rect; 191 pin, 29.00 mm L X 19.00 mm W X 7.90 mm H body Commonly Visited
