Industry Directory: memory modules (41)

Memory Bay

Industry Directory | Consultant / Service Provider / Manufacturer

MemoryDealers designs, manufacturers, and markets memory modules for use in Cisco, Sun, Juniper, PCs, laptops, and legacy devices. With distribution centers in the United States, United Kingdom, Korea, and Japan, MemoryDealers provides a total soluti

EASE memory industrial ltd.

Industry Directory |

We carry Elpida memory and running business for more than 10 years. Our closely partner is a DRAM Module and 3C gizmo EMS.

New SMT Equipment: memory modules (262)

Electronics Forum: memory modules (57)

memory module conveyor belt and stacker

Electronics Forum | Tue Jan 05 21:01:40 EST 2021 | brianjones

We are looking at setting up a memory module conveyor belt with a stacker and de-stacker. I will need to handle DDR3 and DDR4 Long DIMM and SODIMM. I will be mounting an image camera under and over the modules. Looks like an edge conveyor would be be

First-Pass Yield Information

Electronics Forum | Tue Jul 03 09:13:18 EDT 2001 | rstodd

I work for a memory module manufacturer and I am interested in obtaining information on typical first-pass yield numbers and failure rates in the memory module industry for benchmarking purposes. Any information provided would be greatly appreciated

Used SMT Equipment: memory modules (188)

BTU Pyramax 100A

BTU Pyramax 100A

Used SMT Equipment | Soldering - Reflow

BTU Pyramax 100A Reflow Oven Vintage: 2012 LOW HOURS Edge Rail Mesh Belt L to R Flow Programmable Width Adjust Smart Tracker SMEMA Bottom Cooling Fans 480V 3-Phase UPGRADE Kit Recently Added ($13k Value) - Intellimax 2 Module Assembly - Wincon 7.2 So

Midwest SMT

ASC International ASC paste thickener 3D SPI-6500 thick paste inspector

ASC International ASC paste thickener 3D SPI-6500 thick paste inspector

Used SMT Equipment | SPI / Solder Paste Inspection

Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser

KingFei SMT Tech

Industry News: memory modules (235)

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: memory modules (42)

Samsung Samsung cp45 Mounter board / MK3 board / cp40 ADDA / DSP

Samsung Samsung cp45 Mounter board / MK3 board / cp40 ADDA / DSP

Parts & Supplies | Assembly Accessories

After receiving the input signal of home sensor of motor related to head, it is transmitted to can master BOARD.CONVEYOR Control board receive controller The sensor input with ANC and the input of the switch on the operation panel are transmitted t

KingFei SMT Tech

Juki JUKI 106 NOZZLE E35067210A0

Juki JUKI 106 NOZZLE E35067210A0

Parts & Supplies | Chipshooters / Chip Mounters

JUKI 106 NOZZLE E35067210A0 JUKI E9672729B00 MONITOR BRACKET JUKI E96747290B0 COPLANARITY UNIT ASM JUKI E9674729A00 FILTER UNIT JUKI E9674729B00 FILTER UNIT JUKI E9675729000 SENSOR CABLE JUKI E9676729000 VGA SWITCHING UNIT JUKI E9678729000 REAR MON

ZK Electronic Technology Co., Limited

Technical Library: memory modules (2)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Technical Library | 2020-05-07 03:46:27.0

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.

SELECT Products | Nordson Electronics Solutions

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Technical Library | 2022-08-08 15:06:06.0

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.

Hentec Industries, Inc. (RPS Automation)

Videos: memory modules (68)

PCB Depaneling Router|PCB printed circuit board depaneling|PCB router

PCB Depaneling Router|PCB printed circuit board depaneling|PCB router

Videos

http://www.pcb-separator.com/plus/view.php?aid=85 ??????/PCB?????/???????/Programmable PCB Separator/desktop pcb separator/Professional CNC Router/pcb depaneling router/PCB Separator manufacturer

ASCEN Technology

automatic PCB router machine|PCB router depanel|PCB separator

automatic PCB router machine|PCB router depanel|PCB separator

Videos

http://www.pcb-separator.com/plus/view.php?aid=85 ??????/PCB?????/???????/Programmable PCB Separator/desktop pcb separator/Professional CNC Router/pcb depaneling router/PCB Separator manufacturer

ASCEN Technology

Career Center - Jobs: memory modules (8)

PCB design engineer

Career Center | San Jose, California USA | Engineering

Headquartered in San Jose, as leading PC component distributor and rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR, SD-RAM, SO-DIMM and F

Ma labs

Memory Architect/Product Engineer

Career Center | San Jose, California USA | Engineering

Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR

Ma labs

Career Center - Resumes: memory modules (11)

Manufacturing Tech/Eng/Manager

Career Center | Costa Mesa, California | Maintenance,Production,Technical Support

Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 17yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, Electrovert equipment. Have also done off-

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: memory modules (116)

Partner Websites: memory modules (33)

Programmable logic controller in industry at productronica

| https://productronica.com/en/trade-fair/key-topics/plc-programmable-logic-controller/

. In other words, a processor, memory, power supply unit, and the input and output modules (I/O modules) were enough for half a century to automate sequential or repetitive production processes little fault tolerance in sometimes the harshest industrial environments via PLC

In-Circuit Test Archives - Lewis and Clark

Lewis & Clark | http://www.lewis-clark.com/product-tag/in-circuit-test/

:   3070 Series 3 Modules : 2 Configured with: (1) Windows PC (18) HyDD cards (2) XTP (2) Asru C Service inclusions: Refurbishment Parts exchange warranty Installation optionally available. Availability

Lewis & Clark


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