New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
Electronics Forum | Thu Jan 28 10:09:51 EST 1999 | Charles Stringer
| | | | Greetings, | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | Also, is there any danger of the pcb's giving off some kind of g
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2023-01-23 17:37:22.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.
SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
.........................................................................................................16 5.2.2 Flux.............................................................................................................17 5.2.3 Solvents......................................................................................................17 5.2.4
