GS Praezisions AG is a Swiss manufacturer of flex and rigid flex circuit boards. We spezialize in miniaturization and produce chip on board and flip chip substrates with micro via in laser and plasma technology among standard multilayer HDI PCBs.
Industry Directory | Manufacturer
We specialize in manufacturing high quality HDI PCBs.We manufactured lots of high complicated HDI PCBs(3+N+3,4+N+4,5+N+5,6+N+6,7+N+7 and micro-vias for anylayer) I will be happy to show some HDI PCBs we did if you have interest.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Electronics Forum | Mon Sep 01 21:26:51 EDT 2014 | proy
We are a smaller company and have created our own systems using FilemakerPro, and it grows and evolves with us as we constantly improve it. Filemaker is a complete relational database system wrapped up WITH the tools to create your user interface -
Electronics Forum | Fri Jun 21 02:16:31 EDT 2019 | alanyang
ask your supplier to make micro-section to check whether it is delamination.
Used SMT Equipment | Pick and Place/Feeders
PROTOPLACE S - SEMI-AUTOMATIC SMT ASSEMBLY SYSTEM DESCRIPTION: SMT Pick & Place of PCB Prototypes The LPKF ProtoPlace S is an ergonomically designed, semi-automatic pick & place system for the professional assembly of SMT printed circuit board protot
Used SMT Equipment | In-Circuit Testers
Keithley 2410 Model 2410 High-Voltage SourceMeter w/ Measurements up to 1100V and 1A, 20W Power Output Key Features and Benefits: New class of instruments designed for high speed DC testing Family of products offers wi
Industry News | 2011-09-21 12:11:34.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high resolution pumps in Booth #133 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Technical Library | 2001-04-24 10:44:24.0
This paper reviews the possible implementations of the Micro Via Technology within the Mentor Graphic's Board Station environment, specifically within the Librarian, Layout and Fablink applications. In this context, the definition of a Micro Via is constrained to Board Station’s support of such technology and contains only generalized descriptions of the manufacturing processes that require Micro Vias.
Technical Library | 2019-06-26 23:21:49.0
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
SMTnet Express, July 18, 2019, Subscribers: 32,162, Companies: 10,836, Users: 24,951 Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Credits: MacDermid Inc. The increased demand for electronic devices in recent years
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/hdi/
. Our micro via formation technology uses lasers to drill micro vias, also called blind via-holes (BVHs). With the ability to place on or off the pads, these holes let you selectively create routing room in denser parts of the substrate
