Industry Directory | Manufacturer
UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly
Industry Directory | Manufacturer
A printed circuit board manufacturer producing high quality prototype printed circuit boards.
- Uses infrared heat wave technology instead of the conventional hot air, effectively solves the major problem being encountered when using the hot air gun, which is the movement of surrounding components while reworking. - Aoyue 710 brings sophistic
New Equipment | Assembly Services
Multiiple assembly lines and highly trained staff support IPC level 1, 2, and 3 assembly of both surface mount and through-hole technology products. PCB assembly we offer: Surface mount, including BGAs and micro-BGAs Through-hole Mixed
Electronics Forum | Tue Jan 17 11:51:05 EST 2006 | james
What about doing this method on Micro Bgas?
Electronics Forum | Mon Jul 12 13:27:35 EDT 1999 | Upinder Singh
Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry standards for uBGAs and of wha
Industry News | 2012-05-09 13:57:33.0
SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony,
Industry News | 2012-01-13 13:27:59.0
The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?
Technical Library | 2013-08-07 21:52:15.0
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
| https://www.wesource.com/aoi/cyberoptics-se500-solder-paste-inspection-id-140068-3/23/
: CyberOptics SE500 Solder Paste Inspection System Model: Accurate 3-D SPI Serial Number: 60006 Notes: The SE500 provides 3-D height, volume and area measurements for PCB's with CSPS, micro-BGAs, 0201s, 01005s and other small pad sizes for which measuring solder volume is critical in verifying solder joint reliability. Vintage: Nov. 2009 Asset
| https://www.eptac.com/soldertips/soldertip-44-ipc-guidelines-for-flux-selection-and-use/
. Things to consider on your product are entrapment areas where the flux may travel to and you cannot clean it off. This can be a major problem with surface mount components, especially those mounted very close to the surface of the board, such as micro BGAs, chip caps and resistors. So where are we
