Industry Directory | Research Institute / Laboratory / School
Department of Electrical, Electronics and Computer Engineering (DIEEI).
Industry Directory | Consultant / Service Provider / Manufacturer
From the Irvine, CA office Nanovea began designing and manufacturing instruments after years of experience in providing solutions for profilometry, mechanical and tribology applications.
Thickness: 2mm/3mm øStandard Dimension (W*L): 0.6m*10m/ 0.8m*10m/ 0.9m*10m/ 1.0m*10m/ 1.2m*10m øColor: Green/Black, Blue/Black, Grey/Black, Green/Green, Black/Black, Blue/Blue øøøAnti-static rubber mat should be laid out
ESD Mat/ESD Rubber Mat/ Antistatic Mat/ESD matting Antistatic table mat or conductive ground mat should be laid out in the workshops and advanced laboratories for microelectronic industries such as electronic semi-conduct devices, electronic compute
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Industry News | 2012-05-29 13:32:44.0
SMTA and MEPTEC announce the keynote speakers for the two-day symposium titled "Medical Electronics Technology, Personal Health and the Economy - Drivers for Positive Business Growth."
Industry News | 2004-10-30 23:50:28.0
Minneapolis, MN
Technical Library | 2019-07-30 15:29:50.0
Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50°/75°C, -55°/100°C, and -55°/125°C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Events Calendar | Thu Mar 16 00:00:00 EDT 2017 - Thu Mar 16 00:00:00 EDT 2017 | Didcot, Oxfordshire, United Kingdom
MicroTech 2017 Advanced Packaging & Technology Trends- IMAPS UK Annual Conference
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
in Microelectronics : Materials, Processes, Reliability, an
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/keynotes.cfm
Pan Pacific Microelectronics Symposium Pan Pacific Microelectronics Symposium February 1-4, 2021 | Honolulu, Oahu, Hawaii About Call for Abstracts 2020 Program Hotel Keynote Speakers Several keynote speakers will present during the upcoming Pan Pacific Microelectronics Symposium this February
| http://www.thebranfordgroup.com/dnn3/Auctions/RecentAuctions.aspx
. Equipment as late as 2019 Laboratory Analytical Instruments Freund Vector Hi-Coater System Cork & Limerick Ireland Branson & Dukane Ultrasonic Welders [Online
