LPKF ZelFlex � Pneumatic Rapid Stretching Frames for most world-wide available SMT printers, www.zelflex.com, screen printing, stencil printing, Pick&Place, reflow, SMT Assembling, Rapid Prototyping, Laser Cutting and Drilling, microvia, www.lpkf.si
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PCB-supplier, Flexprint, HDI, Microvia, blind via, burried vias ect.
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The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
MLT provides microvia laser drilling services for both rigid and flexible circuit board manufacturers. MLT is a leader in HDI drilling and design consulting to minimize drilling costs. All IPC high density microvia types are supported in most any s
Electronics Forum | Thu Oct 11 15:42:44 EDT 2012 | anvil1021
Yes they are but not durectly in the center,I was also noticing that even our passive components have voids where the microvias are? As a matter of fact there are up to 5 microvias in the passive pads? There was a previous design that had the micro
Electronics Forum | Fri May 10 14:55:59 EDT 2002 | xrayhipp
Pete, thanks for the input. These are microvias and dont go through the pcb -- they are laser cut to various depths into the board and are .006" dia. on gold plated pads. Paul.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Tue May 30 00:00:00 EDT 2023 - Tue May 30 00:00:00 EDT 2023 | ,
Ontario Webinar: Microvia Reliability - Understanding the Effects of Process, Design & Materials
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
SMTnet Express, May 12, 2016, Subscribers: 24,536, Companies: 14,773, Users: 40,243 Influence of Plating Quality on Reliability of Microvias Yan Ning, Michael H. Azarian, Michael Pecht; CALCE Center for Advanced Life Cycle Engineering Advances
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