Industry Directory | Consultant / Service Provider / Manufacturer
PCB-supplier, Flexprint, HDI, Microvia, blind via, burried vias ect.
Industry Directory | Manufacturer
One-Stop Solution for PCB & Prototype Assembly Expanded PCB manufacturing capabilities to support advanced designs with demanding requirements including laser-drilled microvias, cavity boards, heavy copper up to 20 oz., via-in-pad
New Equipment | Fabrication Services
XPCB is your trusted partner for high-performance RF PCB manufacturing, from prototype to mass production. We specialize in delivering exceptional quality and precision for demanding applications: Advanced Materials Expertise:We work with a wide rang
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Technical Library | 2015-05-14 15:45:45.0
The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Mon May 29 18:30:00 UTC 2023 - Mon May 29 18:30:00 UTC 2023 | ,
Ontario Webinar: Microvia Reliability - Understanding the Effects of Process, Design & Materials
Events Calendar | Wed Oct 29 18:30:00 UTC 2025 - Wed Oct 29 18:30:00 UTC 2025 | ,
Designing for Space: Understanding the IPC-6012 Space Addendum
Career Center | San Jose, California USA | Engineering,Management,Research and Development
Ph.D., MBA, senior technical & management experience, advanced technology, electronics manufacturing processes, packaging, miniaturization, reliability, global team, PWB assembly, soldering Experience: 2001 - Flextronics, San Jose, CA Senior Manage
Career Center | San Jose, California USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
7044 Elmsdale Drive, San Jose, CA 95120 Phone: (408) 323 8971 E-Mail: DShangguan@Yahoo.Com Key Words: Ph.D., MBA, technical & management experience, advanced technology, electronics manufacturing processes, packaging, miniaturization, reliability, g
SMTnet Express, July 14, 2022, Subscribers: 25,319, Companies: 11,585, Users: 27,344 █ Electronics Manufacturing Technical Articles Reliability Testing For Microvias In Printed Wire Boards Traditional single level microvia structures
SMTnet Express, May 12, 2016, Subscribers: 24,536, Companies: 14,773, Users: 40,243 Influence of Plating Quality on Reliability of Microvias Yan Ning, Michael H. Azarian, Michael Pecht; CALCE Center for Advanced Life Cycle Engineering Advances
