Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
Greenmil offers :- PCB DESIGN,PCB FABRICATION, PDB ASSEMBLY,COMPONENT PROCUREMENT
New Equipment | Rework & Repair Equipment
These Made in America, Beau Tech RocHard MilProbes are the only complete line of probes available to meet the full spectrum of circuit repair, rework, and assembly needs from Through Hole to 2 mil pitch Surface Mount.
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
Electronics Forum | Thu May 29 16:14:34 EDT 2003 | steves
What is the general feeling in the industry on the use of 15.7 mil QFP's? Are most people shying away from them in favor of BGA or do most people consider 15.7 mil to be "standard" technology these days? What special considerations are involved? Ste
Electronics Forum | Thu Aug 12 18:43:49 EDT 1999 | Wayne S.
Hello Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening 100 durometer blade. Getting "tails" on deposits. Trie
Used SMT Equipment | Pick and Place/Feeders
Includes Parts Tray Feeder OS: Windows XP SW: 8.3.0.10 Cameras: Front ULC magellan firewire 1394 .94 mil per pixel. Rear ULC firewire 2.3 per pixel. Pecs: pec beam1 firewire 1394 .66 mil per pixel. pec beam 2 firewire 1394 .
Used SMT Equipment | Pick and Place/Feeders
OS: Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel. pec beam 2 firewire
Industry News | 2003-02-21 08:34:42.0
Will be listed as the highest technology supplier on the QML, Tyco Electronics stated.
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Parts & Supplies | Soldering Equipment/Fluxes
Two-Piece Fine Pitch RocHard 10 MilProbe Kit
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2010-03-25 06:26:37.0
The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue May 12 00:00:00 EDT 2020 - Thu May 14 00:00:00 EDT 2020 | Baltimore, Maryland USA
IPC High Reliability Forum
Career Center | Wylie, Texas USA | Engineering,Production,Quality Control
Candidate needed for source inspection to the requirements of Mil-P-55110 IPC 6011, class 1,2 and 3 IPC 6012, class 1,2 and 3, PWB-PWG, Exp. with PWA and soldering necessary.
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | Brookfield, ALL USA | Management,Production
Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T
Career Center | , | 2011-11-16 09:17:11.0
Mil standards 464, Mil Standards 2000, ESD Training, Cellular Manufacturing, TQM Totally Quality Manufacturing, ISO 9000 and 9001 IPC Standards, IPCA-610, IPC-J-STD-001E, OSHA training, LEAN Manufacturing, JIT (Just In Time) Six Sigma, AS400 Systems
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-terminal-size-mil-to-mm-rounding_topic2190.html
BGA Terminal Size Mil to mm Rounding - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login BGA Terminal Size Mil to mm Rounding
| https://www.eptac.com/ask/addressing-circular-mil-area-cma-buildup/
Addressing Circular Mil Area (CMA) Buildup - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
