High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.
Industry Directory | Manufacturer
A printed circuit board manufacturer producing high quality prototype printed circuit boards.
New Equipment | Rework & Repair Equipment
Standard Flat Reamer/Straight Fork Tip (SH-20A) (8") Description: Straight Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Straight Flat Reamer: SH-20C, SH-20E Tools with the Standard Straight Flat Reamer: SH-20A
New Equipment | Rework & Repair Equipment
Angled Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Angled Flat Reamer: SH-20D Tools with the Standard Angled Flat Reamer: SH-20B Applications 30 degree bend at the tip allows access to more difficult areas. Us
Used SMT Equipment | Chipshooters / Chip Mounters
Yamaha SMT YSM10 Placement Machine Applicable PCB L 510 x W 460mm - L 50 x W 50mm * Consult us for board sizes exceeding dimensions L510 Mounting capability HM Head (10 Nozzle) Spec. HM5 Head (5 Nozzle) Spec. 46,000CPH (The Comp
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Yamaha YSM10 Pick and Place High-Speed Modular SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT Pick and Place Machine, Yamaha Chip mounter, for SMT assembly system. Applicable PCB L 510 x W 460mm - L 50 x W
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Career Center | Tulsa, Oklahoma USA | Engineering
Our client has an immediate need for an SMT Process Engineer in Tulsa, OK The company is a recognized leader in the electronics manufacturing services industry. They are a proven provider of complete, solutions-oriented contract manufacturing servic
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | San Diego, California USA | Engineering,Management,Quality Control,Research and Development
ENGINEER, NPI, MANUFACTURING ASSEMBLY PROCESSES, 23 years experience #11;SOLDERING, MTLS & PROCESS ENGINEER, CIRCUIT CARD ASSEMBLY, ESDS PROGRAM MANAGER, QUALITY ENGINEER. Former Mil Spec INSTRUCTOR/EXAMINER (Cat C),
Career Center | Jackson, Georgia USA | Production
MARIE M. FLANAGAN 138 Katy Lake Rd. Jackson, GA 30233 E-Mail: escape0827@aol.com (770) 775-3498 October 3, 2002 Dear Sir, I have worked in the electronics manufacturing field for over fifteen years. Although I do not have a degree, I am a high
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