Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
Electronics Forum | Sat Jul 22 04:52:31 EDT 2023 | shrikant_borkar
Here below clarification may help you I suggest you to refer IPC-AJ-820A Assembly and Joining Handbook for the entire information of applicable standards. IPC-J-STD (IPC-Joint Standard): IPC-J-STD is not a standalone standard; it refers to the serie
. Read Answer IPC-5704 vs IPC-6012 Bare Board Cleanliness Comparison Question: I am reviewing IPC-5704, and have a question. When reviewing table 4-1, the chloride limit is
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
BGA288 19x19 mm 1.0 mm A-CABGA288- .8mm-19mm- DC Test Vehicle The test board was 2.18mm (86 mil) thick with 14 dummy inner layers. The board was constructed using FR-4 material in accordance with IPC-4101/126 with an electroless nickel/immersion gold (ENIG
IPC is the trade association for the printed wiring board and electronics assembly industries.
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