Industry Directory | Manufacturer
Caring Circuit specialises in the supply of prototype, small and medium-series PCBs factory in Shenzhen,China.We are a leading provider of custom Single layer,double layer,multilayer rigid PCBs.
Industry Directory | Distributor / Other
ASAP Part services is a One Click Purchasing Solutions for fasteners, and bearing and connector components to servicing all branches of US Defense. We have customized database of over 35 million parts
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Used SMT Equipment | Flexible Mounters
Product Name: Samsung SM481 high speed chip mounter Product number: SM481 Detailed product introduction Samsung SM481 high speed chip mounter parameters SM481 is based on the platform of high-speed SMT SM471 the fastest equipment at strengthening
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2018-04-15 20:01:15.0
SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Parts & Supplies | SMT Equipment
Lead Cutting Machine - Capacitor Cutter 301 Specifications This lead forming machine is used to lead-cutting and forming of taped resistors, diodes, and other axial components. FEATHERS 1. It is used to cut radial leads of bulk radial
Parts & Supplies | General Purpose Equipment
Lead Cutting Automatic Taped C-306C Specifications This lead forming machine is used to lead-cutting and forming of taped resistors, diodes, and other axial components. FEATHERS 1. It is used to cut radial leads of bulk radial compone
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Career Center | Lancaster, Pennsylvania USA | Engineering
Provide leadership to the engineering staff and manage, initiation and completion of all engineering deliverables. Deal with customers, business associates, program managers, manufacturing, planning, marketing and purchasing. Requires extensive kno
Career Center | Charleston, South Carolina USA | Engineering,Maintenance,Production,Quality Control,Technical Support
UEC serves the aerospace, military, industrial, and commercial markets by providing comprehensive product design, system integration, and vertically integrated manufacturing solutions including: hardware, software, and mechanical engineering; rapid
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | Pune, Maharahtra India | Engineering,Maintenance,Technical Support
SMT Test Engineer/Electrical Automation Engineer. Good exposure on Agilent, Vitrox, Vi tech and TRI Aoi,s Good exposure on agilent ICTS and DAGE X rays.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-error-padpad-clearance-fail_topic2283.html
Footprint Error Pad-Pad clearance fail - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Footprint Error Pad-Pad clearance fail
KingFei SMT Tech | http://www.smtspare-parts.com/sale-9135913-japan-origin-ipulse-m018-smt-nozzle-m1-m4-nozzle-for-electrical-machine.html
Japan Origin Ipulse M018 SMT Nozzle M1/ M4 Nozzle For Electrical Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
