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Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
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Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
Ground Pours - To Pour Or Not To Pour? Ground Pours - To Pour Or Not To Pour? Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias
GPD Global | https://www.gpd-global.com/pdf/pbt/PBFT-VS-SPC-User-Guide-20041102-PBT-002_CD-FORCEWare-v3-3.pdf
wheel handle (see figure below, Item 3) down and push the spring-loaded knob (Item 2). This locks the draw wheel rollers (Item 1) in the open position. b. To accommodate the width of the carrier tape, use the adjustment screws (Item 6) to adjust the tape
IPC is the trade association for the printed wiring board and electronics assembly industries.
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